Cleaning Implement Continuous Bonding for High-Speed Production

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Solution Overview

Problem

The existing method for manufacturing cleaning tools with cleaning sheets and holders faces challenges in achieving high-speed production due to the need for a temporary stop during the bonding process of superposed materials.

Innovation Solution

A method and device that continuously convey band-like elements to a bonding device with a drum roller and bonding section, forming bonded regions without stopping, allowing for high-speed production by using multiple bonding sections and configurations such as overlapping or non-overlapping bonded regions with varying areas.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a temporary stop is introduced during the bonding process of superposed materials, then bonding quality is improved, but production speed deteriorates

Engineering Contradiction:
Improvebonding qualityVSAvoidproduction speed
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent implements continuous conveyance of superposed materials through the bonding device without temporary stops. The bonding device processes materials in a continuous flow, eliminating idle time while maintaining bonding quality through optimized bonding parameters and multiple bonding sections that work in parallel or sequence.

Inventive Principle:
Principle #20Continuity of useful action

Solution Approach 2:

The bonding device is divided into multiple bonding sections, each capable of forming bonded regions independently. This segmentation allows different sections to process different portions of the superposed materials simultaneously, maintaining continuous production while ensuring adequate bonding at each section.

Inventive Principle:
Principle #1Segmentation

2Reliability

If multiple bonding sections are used to form bonded regions, then bonding reliability is improved, but device complexity increases

Engineering Contradiction:
Improvebonding reliabilityVSAvoidbonding device complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

Multiple bonding sections share common structural components, control systems, and material handling mechanisms. Each bonding section performs the same bonding function but on different portions of the material, allowing the system to achieve enhanced reliability through redundancy while minimizing complexity through component sharing and standardization.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables efficient and high-speed manufacturing of cleaning tools by eliminating the need for temporary stops and providing flexibility in bonding patterns, leading to a more rational construction technique.

Implementation Method 1

a bonding device having a drum roller and a bonding section... forming a bonded region in a prescribed region of the superposed band-like elements by the bonding device

Methodology Applied
Scientific EffectThermal bonding: Heating

Data Source

PatentUS10568486B2Production method and production apparatus for cleaning implement
Publication Date: 2020.02.25 UNI CHARM CORP
  • US10568486B2 patent drawing
  • US10568486B2 patent drawing
  • US10568486B2 patent drawing

AI summary

To provide a more logical construction technique relating to a production method and a production apparatus for a cleaning implement. Provided are a production method and a production apparatus for a cleaning implement having a cleaning sheet and a holder, the method including: a step of supplying a plurality of strip elements; a step of superimposing the plurality of strip elements; a step of supplying the superimposed strip elements to a bonding apparatus having a drum roll and a bonding process section; and a step of forming bonded zones in predetermined zones of the superimposed strip elements by the bonding apparatus.