Cleaning Substrate Patterns for In-Situ Chuck Particle Removal

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Solution Overview

Problem

Conventional chuck cleaning in process chambers requires manual processes that involve machine shutdowns, complex calibration, and limited access, leading to inefficiencies and non-uniform wafer temperature due to particle contamination.

Innovation Solution

A cleaning assembly with substrates featuring patterns that attract particles via electrostatic or mechanical trapping, integrated into a system for in-situ cleaning, utilizing handling devices and characterization systems to automate the process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If manual cleaning processes are used to remove particles from the chuck, then the chuck can be cleaned, but the machine must be shut down and complex calibration is required

Engineering Contradiction:

Improvecleaning effectivenessVSAvoidmachine downtime

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The cleaning substrate is prepared with patterns and cleaning structures in advance, before being introduced into the process chamber. This preliminary preparation allows the cleaning to occur in-situ without requiring machine shutdown or complex calibration procedures, thus maintaining productivity while ensuring reliable cleaning.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The cleaning substrate is designed to automatically attract and trap particles from the chuck through electrostatic attraction and mechanical trapping mechanisms. This self-service capability eliminates the need for manual cleaning operations, complex calibration, and machine shutdown, thereby maintaining both cleaning effectiveness and machine productivity.

Inventive Principle:

Principle #25Self-service

2Ease of operation

If the process chamber cover is opened to access the chuck for cleaning, then the chuck can be reached, but the cleaning process becomes complex and time-consuming

Engineering Contradiction:

Improvechuck accessibilityVSAvoidcleaning process complexity

Core Design Contradiction:

Ease of operationVSDevice complexity

Solution Approach 1:

The cleaning substrate acts as an intermediary tool that can be introduced into the process chamber through existing wafer handling mechanisms. This intermediary approach allows cleaning to occur without opening the process chamber cover, maintaining ease of operation while simplifying the overall cleaning process by eliminating complex manual procedures.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The cleaning substrate is designed to be handled by the same robotic assemblies and handling devices used for wafers, giving it multi-functionality. This universal approach allows the cleaning tool to be accessed through existing mechanisms without requiring separate access procedures, thereby maintaining ease of operation and reducing process complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Reliability

If manual cleaning with tissue or brush is performed, then particles can be removed, but non-uniform temperature levels occur across the wafer

Engineering Contradiction:

Improveparticle removalVSAvoidwafer temperature uniformity

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The cleaning substrate is designed as a disposable or easily replaceable component that is introduced specifically for cleaning operations. This approach ensures that cleaning particles are effectively removed while the substrate itself is discarded or regenerated, preventing any potential source of non-uniformity from being transferred to subsequent wafers, thus maintaining temperature uniformity and manufacturing precision.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The manual mechanical cleaning process (tissue or brush) is replaced with an automated system using a cleaning substrate with specific patterns and electrostatic properties. This substitution provides more controlled and uniform particle removal, preventing the creation of non-uniform surfaces that would cause temperature variations across the wafer, thereby maintaining manufacturing precision.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables efficient, automated chuck cleaning without machine shutdowns, maintaining wafer uniformity by effectively removing particles while minimizing contamination and reducing downtime.

Implementation Method 1

one or more structures within the one or more patterns attract one or more particles from the chuck via at least one of electrostatic attraction

Methodology Applied

Scientific EffectElectrostatic attraction: Electrostatics

Implementation Method 2

one or more structures within the one or more patterns attract one or more particles from the chuck via at least one of electrostatic attraction or mechanical trapping

Methodology Applied

Scientific EffectMechanical trapping: Adsorption

Data Source

PatentUS12370581B2In-situ process chamber chuck cleaning by cleaning substrate

Publication Date: 2025.07.29 KLA CORP

AI summary

A cleaning assembly is disclosed. The cleaning assembly includes a substrate. One or more patterns are formed on a bottom side of the substrate. One or more structures within the one or more patterns attract one or more particles from a chuck via at least one of electrostatic attraction or mechanical trapping when the substrate is positioned on the chuck.