Cleaning Tool Torque Control for Fast Substrate Self-Cleaning
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Solution Overview
Problem
The existing substrate cleaning processes face inefficiencies due to prolonged self-cleaning times, which reduce overall processing efficiency and can lead to substrate contamination from processing debris left on the cleaning tool.
Innovation Solution
A substrate cleaning apparatus and method that utilize a controlled pressing force and rotational speed of the cleaning tool against a self-cleaning member, with adjustable torque and temperature conditions, to enhance the self-cleaning effect in a short time period.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If self-cleaning time is extended to improve cleaning effectiveness, then processing debris is more thoroughly removed from the cleaning tool, but overall substrate processing time efficiency decreases
Solution Approach 1:
The patent applies parameter changes by dynamically adjusting the pressing force applied to the cleaning tool during self-cleaning based on detected rotational speed and pre-stored optimal parameter data. This allows the system to achieve effective cleaning with optimized time by selecting pressing force values that maximize cleaning efficiency for specific rotational speeds, thereby resolving the contradiction between cleaning effectiveness and processing time efficiency.
2Reliability
If rotational speed of cleaning tool is increased to enhance self-cleaning effect, then frequency of contact between cleaning tool and self-cleaning member increases, but friction may become excessive causing abrasion and deterioration of cleaning tool
Solution Approach 1:
The patent implements dynamics by continuously detecting the rotational speed of the cleaning tool and dynamically adjusting the pressing force in real-time based on the detected speed and pre-stored optimal parameters. This dynamic adjustment ensures that friction remains within an optimal range that provides sufficient self-cleaning effect while preventing excessive abrasion and deterioration of the cleaning tool.
Solution Approach 2:
The system employs feedback by detecting the actual rotational speed of the cleaning tool during self-cleaning and using this detected value to select the appropriate pressing force from pre-stored optimal parameters. This closed-loop feedback mechanism ensures that the pressing force is always matched to the current operational conditions, optimizing both cleaning effectiveness and tool durability.
3Reliability
If pressing force is increased to improve self-cleaning effect, then processing debris is more effectively discharged from cleaning tool, but abrasion and deterioration of cleaning tool increases
Solution Approach 1:
The patent applies parameter changes by storing multiple pressing force values in advance, each corresponding to a specific rotational speed. The system selects the optimal pressing force from these pre-stored values based on the detected rotational speed, ensuring that sufficient pressing force is applied for effective debris discharge while avoiding excessive force that would cause abrasion and deterioration of the cleaning tool.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution enables highly effective self-cleaning of the cleaning tool in a short time, maintaining processing efficiency while preventing substrate contamination.
Implementation Method 1
The self-cleaning effect is affected by friction between the cleaning tool and the self-cleaning member
Implementation Method 2
increase in the temperature of the cleaning liquid is assumed to make polishing debris more likely to be discharged into the cleaning liquid and enhance the self-cleaning effect
Data Source
AI summary
There is provided a substrate cleaning apparatus capable of highly effective self-cleaning of a cleaning tool in a short time period. The substrate cleaning apparatus includes a cleaning tool for cleaning a substrate while in contact with a surface of the substrate, a self-cleaning member for self-cleaning the cleaning tool while in contact with the cleaning tool, a rotation mechanism for rotating the cleaning tool, and a holding mechanism for holding the cleaning tool, the holding mechanism being capable of pressing the cleaning tool against the substrate and pressing the cleaning tool against the self-cleaning member. The substrate cleaning apparatus also includes a controller which controls pressing force for the cleaning tool against the self-cleaning member such that self-cleaning torque, with which the rotation mechanism rotates the cleaning tool at the time of self-cleaning of the cleaning tool, is prescribed torque equal to or more than substrate cleaning torque, with which the rotation mechanism rotates the cleaning tool when the cleaning tool cleans the substrate.