Cleanspace Fabricators for Customized Smart Devices
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Solution Overview
Problem
Existing cleanroom designs for advanced technology fabrication are costly and inefficient, as they require large, specialized environments for different cleanliness levels, leading to increased costs and logistical challenges in processing high technology products, particularly in assembling and packaging smart devices and touchscreen devices.
Innovation Solution
The use of cleanspace fabricators that enable processing of high technology products from wafer substrates to final packaging in a single environment, employing additive manufacturing and 3D chip assembly techniques, allowing for customized smart devices and touchscreen devices to be manufactured with reduced packaging and testing costs and quicker turnaround cycles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional cleanroom design with separate processing stations and aisles is used, then processing capability is provided, but the volume of cleanspace controlled increases and cost of building and maintaining cleanliness increases considerably
Solution Approach 1:
The patent transitions from traditional horizontal cleanroom layout with aisles to a vertical tower configuration where processing stations are stacked vertically. This dimensional change allows multiple processing stations to be accommodated in a compact footprint, significantly reducing the horizontal cleanspace volume while maintaining processing capability.
Solution Approach 2:
The patent implements a nested structure where processing stations, automation equipment, and support systems are integrated within each other in a compact tower arrangement. Each processing station is positioned within the vertical structure, with automation equipment and material handling systems nested between and around them, maximizing space utilization.
2Reliability
If traditional cleanroom design with separate facilities for different cleanliness requirements is used, then specific processing needs are met, but logistical challenges and costs increase
Solution Approach 1:
The patent divides the cleanroom into multiple vertically stacked zones, each dedicated to specific processing steps with defined cleanliness requirements. Each zone can be independently controlled and maintained, allowing different cleanliness levels to be achieved in different sections without requiring entirely separate facilities.
Solution Approach 2:
The patent designs a multi-functional processing tower that can handle various processing steps (semiconductor fabrication, assembly, packaging, testing) within a single integrated structure. The system uses universal automation equipment and material handling mechanisms that can serve multiple processing stations, reducing the need for separate specialized facilities.
3Productivity
If rapid processing of all steps in a single location is implemented, then productivity increases, but maintaining cleanliness across all steps becomes more challenging
Solution Approach 1:
The patent introduces automated robots and sealed material handling systems as intermediaries between processing stations. These intermediaries transfer substrates and components between zones without requiring human operators to physically move between cleanliness zones, thereby maintaining contamination barriers while enabling rapid sequential processing.
Solution Approach 2:
The patent implements continuous automated processing where substrates move sequentially through different processing stations without interruption. The automated system maintains continuous operation, with each station performing its function in rapid succession, eliminating idle time and maintaining both productivity and cleanliness control.
Data Source
AI summary
The present invention provides various aspects for processing multiple types of substrates within cleanspace fabricators or for processing multiple or single types of substrates in multiple types of cleanspace environments. In some embodiments, a collocated composite cleanspace fabricator may be capable of processing semiconductor devices into integrated circuits and then performing assembly operations to result in product in packaged form. Customized smart devices, smart phones and touchscreen devices may be fabricated in examples of a cleanspace fabricator. In some examples, the smart devices, smart phones and touchscreen devices may have two touchscreens on opposite sides of the device along with hardware based encryption.


