Click Pad Grounding via Bottom Bracket Protrusion
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The production process of click pads is complex and costly due to the need for assembling multiple components, including a glass panel, circuit board, dome sheet, and bottom bracket, with an additional grounding metal strip, which increases assembly time and expense.
Innovation Solution
A streamlined click pad structure featuring a top board, circuit board, metal elastic board, conductive connection layers, bottom bracket, and restoration unit, where the metal elastic board and bottom bracket are designed with protruding parts and holes for grounding, eliminating the need for an additional grounding metal strip and simplifying assembly through adhesive layers and Surface-Mount Technology.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an additional grounding metal strip is installed between the circuit board and the bottom bracket, then grounding function is improved, but device complexity and assembly time increase
Solution Approach 1:
The grounding function is merged into the bottom bracket structure itself. The bottom bracket includes a grounding protruding part that directly contacts the circuit board's grounding pad, eliminating the need for a separate grounding metal strip. This integration maintains grounding reliability while reducing component count and assembly complexity.
Solution Approach 2:
The bottom bracket is designed to serve multiple functions: structural support, positioning, and grounding. The grounding protruding part of the bottom bracket simultaneously provides mechanical support and electrical grounding, making the component universal and reducing the need for additional specialized components.
2Reliability
If multiple components (glass panel, circuit board, dome sheet, bottom bracket) are assembled with additional grounding metal strip, then functional requirements are met, but production time and cost increase
Solution Approach 1:
Multiple functions are combined into the bottom bracket component. The grounding function is integrated into the bottom bracket's structure through the grounding protruding part, which eliminates the need for a separate grounding metal strip. This reduces the number of assembly steps and components, thereby improving production efficiency while maintaining functional performance.
Solution Approach 2:
The grounding function is extracted from the separate grounding metal strip and incorporated into the bottom bracket structure. This extraction eliminates the need for the additional grounding component, simplifying the assembly process and reducing production time while maintaining the required grounding functionality.
3Stability of the object's composition
If traditional assembly process with multiple components is used, then structural requirements are satisfied, but manufacturing cost increases
Solution Approach 1:
The grounding function is merged into the bottom bracket, reducing the total number of components that need to be manufactured and assembled. This integration simplifies the manufacturing process, reduces material costs, and lowers assembly complexity while maintaining the structural integrity required for the click pad assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces production costs and time by eliminating the need for an additional grounding metal strip, allowing for easier assembly and integration of components along the Z-axis, enhancing manufacturing efficiency and reducing component complexity.
Implementation Method 1
The metal elastic board includes a metal elastic board main body and at least one connection part. A buffer gap is formed between the metal elastic board main body and the circuit board.
Implementation Method 2
The conductive connection layer is connected to the connection part and the circuit board.
Implementation Method 3
The click pad further includes a first adhesive layer, and the first adhesive layer is located between the top board and the circuit board. The click pad further includes a second adhesive layer, and the second adhesive layer is located between the protruding part and the metal elastic board main body.
Data Source
AI summary
A click pad which is applied to an electronic device includes a top board, a circuit board, a metal elastic board, a conductive connection layer, a bottom bracket and a restoration unit. The circuit board is located under the top board and connected to the top board. The metal elastic board under the circuit board includes a metal elastic board main body and a connection part. A buffer gap is formed between the metal elastic board main body and the circuit board. The connection part connects to the metal elastic board main body. The conductive connection layer connects to the circuit board and the connection part. The bottom bracket under the metal elastic board includes a protruding part. The protruding part supports the metal elastic board main body. The restoration unit supports the circuit board.