Clip Bond Recess Structure for Uneven Bond Line Thickness
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Solution Overview
Problem
Semiconductor devices face issues with clip bond placement variations leading to uneven positions, which can cause breakage and cracking, particularly in areas with large bond line thickness, reducing package reliability and increasing manufacturing costs.
Innovation Solution
The formation of a clip bond with multiple bond line thicknesses and recess depths is achieved through processes like stamping, etching, or 3D laser printing, ensuring robust placement and reducing tilting and damage risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a uniform bond line thickness is used in clip bond, then the manufacturing process is simple, but placement variation causes breakage and cracking in areas with large bond line thickness
Solution Approach 1:
The clip bond structure implements local quality by having different bond line thicknesses at different locations. The first portion has a first bond line thickness while the second portion has a second bond line thickness, allowing each region to be optimized for its specific function and placement conditions, thereby reducing breakage and cracking while maintaining overall reliability
2Adaptability or versatility
If the clip bond is placed in an uneven position, then placement flexibility is improved, but tilting occurs causing breakage and cracking
Solution Approach 1:
The clip bond incorporates local quality through varying bond line thicknesses in different portions, allowing the structure to accommodate placement variations and tilting while maintaining sufficient strength. The differentiated thickness distribution provides tolerance for uneven positioning without causing breakage or cracking in the electrical interconnect
3Power
If a larger contact area is provided in the clip bond, then current rating is improved, but placement variation effects are amplified
Solution Approach 1:
The clip bond structure applies local quality by distributing contact area differently across its portions. The first portion has one bond line thickness while the second portion has another, allowing the total contact area to be large enough for high current rating while the localized thickness variation reduces sensitivity to placement precision requirements
Data Source
AI summary
A semiconductor device has a leadframe and a first electrical component disposed over the leadframe. A clip bond is disposed over the first electrical component. The clip bond has a plurality of recesses each having a different depth. A first recess is proximate to a first distal end of the first electrical component, and a second recess is proximate to a second distal end of the first electrical component opposite the first distal end of the first electrical component. A depth of the first recess is different from a depth of the second recess. A third recess is over a surface of the first electrical component. A depth of the third recess is different from the depth of the first recess and the depth of the second recess. A second electrical component is disposed over the leadframe. The clip bond extends over the second electrical component.