Clip Bond Semiconductor Package Assembly Tool
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Solution Overview
Problem
Current clip bonding technologies face challenges in achieving high throughput and flexibility in assembling clip bond semiconductor packages, particularly in adapting to different clip bond pitches and sizes, which limits efficiency and scalability.
Innovation Solution
A clip bonding system comprising a singulation module, feeder module, transfer module, and clip attach module, which singulates, aligns, and transfers clips to a presentation area for precise pickup and bonding to lead frames, enabling efficient and flexible assembly of clip bond packages across various pitches and sizes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional clip bonding technology is used, then the assembly process is simple, but the throughput is low and flexibility for different pitches is limited
Solution Approach 1:
The system is divided into distinct functional modules: singulation module for separating clips from the strip, alignment module for positioning clips, transfer module for moving clips to the bonding area, and bonding module for attaching clips to leads. This segmentation allows each module to be optimized independently for high throughput while maintaining overall system coordination through centralized control.
Solution Approach 2:
The system incorporates adjustable components and programmable control that enable it to handle multiple clip bond pitches and sizes. The alignment module and transfer module can be reconfigured for different pitch requirements, making the system universally applicable to various clip bond package designs without requiring complete system replacement.
2Productivity
If the system is designed for high throughput, then productivity increases, but adaptability to different clip bond pitches decreases
Solution Approach 1:
The system employs dynamically adjustable components including variable speed conveyors, programmable alignment mechanisms, and reconfigurable transfer paths. These dynamic elements allow the system to maintain high throughput speeds while adapting to different clip bond pitches by adjusting operational parameters and component positions according to the specific package requirements.
Solution Approach 2:
The system utilizes programmable control that allows changing of operational parameters such as transfer speed, alignment position, and bonding force to accommodate different clip bond pitches and sizes. By modifying these parameters rather than physical hardware, the system maintains high throughput while achieving versatility across different package designs.
3Manufacturing precision
If manual or simple automation is used, then device complexity is low, but manufacturing precision and alignment accuracy are insufficient
Solution Approach 1:
The system replaces manual alignment and positioning operations with automated optical alignment systems and precision mechanical stages controlled by computer algorithms. This substitution of mechanical manual operations with automated systems achieves high alignment precision while the modular architecture keeps overall system complexity manageable through standardized interfaces and centralized control.
Data Source
AI summary
The present disclosure is directed to a high throughput clip bonding tool or system which is flexible and easily adapts to different clip bond pitches or sizes. The clip bonding system may be an integrated system with various modules, including a clip singulation module, a feeder module, a transfer module and a clip attach module within a shared footprint. For example, an incoming clip source may be fed to the clip singulation module for clip singulation before the singulated clips are transferred by the feeder and transfer modules to a clip presentation area for clip alignment before pickup. A pickup tool of the clip attach module is configured to facilitate pickup and attachment of clips onto the semiconductor packages to be clip bonded. For example, the pickup head is programmable to facilitate clip bonding process of different applications which may require clips and packages with different sizes.