Clip-to-Busbar Package Layout for Thermal Reliability

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Solution Overview

Problem

Existing electronic device packaging solutions face challenges in achieving high electric performance and thermal reliability, particularly in high-power applications, where overheating can reduce reliability and performance.

Innovation Solution

An electronic device configuration featuring a mounting base, a package with a carrier and encapsulated electronic components, a clip connected to the components, and an oblong electric connection element directly connected to the clip, extending along the mounting base for efficient electricity conduction, which enhances thermal reliability and power performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a bulk connector is used on top of the clip to conduct electricity, then electrical connection is achieved, but thermal reliability and power performance are reduced due to overheating

Engineering Contradiction:

Improvethermal reliabilityVSAvoidoverheating

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The patent transitions from a vertical bulk connector configuration to a planar oblong electric connection element that extends laterally along the mounting base. This dimensional change allows heat to dissipate across a larger surface area in the horizontal plane, reducing thermal concentration and improving thermal reliability while maintaining electrical conductivity.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The oblong electric connection element is divided into multiple contact points along its length, distributing the electrical connection and thermal load across several locations rather than concentrating them at a single bulk connector point. This segmentation reduces localized overheating and improves overall thermal management.

Inventive Principle:

Principle #1Segmentation

2Temperature

If a separate heat sink is added to improve cooling, then thermal management is enhanced, but device complexity and component count increase

Engineering Contradiction:

Improvecooling efficiencyVSAvoidcomponent count

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The oblong electric connection element serves dual functions: it conducts electricity from the clip to the mounting base and simultaneously acts as a heat dissipation path. This multi-functionality eliminates the need for a separate heat sink component, reducing device complexity while maintaining effective thermal management.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The electrical connection function and thermal management function are merged into a single oblong electric connection element. By combining these two previously separate functions, the patent reduces the number of components needed while achieving both electrical conductivity and thermal dissipation.

Inventive Principle:

Principle #5Merging (Combining)

3Reliability

If direct connection between oblong electric connection element and clip is implemented, then thermal reliability improves, but manufacturing precision requirements increase

Engineering Contradiction:

Improvethermal reliabilityVSAvoidconnection precision

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The clip is pre-formed with contact surfaces and positioning features that guide the oblong electric connection element into proper alignment during assembly. This preliminary preparation of the clip structure reduces the precision requirements for the final connection step, making direct connection feasible while maintaining manufacturing efficiency.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration allows for higher power operation with improved thermal reliability and reduced cooling needs, potentially eliminating the need for a separate heat sink, especially in moderate cooling scenarios, while maintaining excellent electric and thermal reliability.

Implementation Method 1

an oblong electric connection element directly connected to the clip, extending along the mounting base for efficient electricity conduction

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

This configuration allows for higher power operation with improved thermal reliability

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250014972A1Package with clip directly connected to oblong electric connection element extending along mounting base

Publication Date: 2025.01.09 INFINEON TECHNOLOGIES AG

AI summary

A package and electronic device are disclosed. In one example, the electronic device comprises a mounting base, an oblong electric connection element, and a package mounted on the mounting base and comprising a carrier, electronic components mounted on the carrier, and an encapsulant at least partially encapsulating the carrier and the electronic components. A clip is connected to upper main surfaces of the electronic components. The encapsulant partially encapsulates the clip so that an exposed surface of the clip is directly electrically connected with the oblong electric connection element extending along the mounting base.