Clip-Based Half-Bridge Power Module Layout for Scalable Low Inductance
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Solution Overview
Problem
Existing power modules with half-bridge topology face challenges in layout complexity, parasitic inductances, and limited scalability due to design constraints, particularly in maintaining clearance distances and adapting outer leads for specific designs.
Innovation Solution
The power module incorporates a support with specific clip configurations and contact areas, allowing for efficient electrical coupling of electronic power devices to form a half-bridge circuit, reducing inductance and enabling scalable designs with symmetrical current paths and simplified connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional leadframe and patterned substrate are used for half-bridge topology, then electrical connections are established, but layout complexity increases and parasitic inductances are generated
Solution Approach 1:
The patent extracts and eliminates the traditional leadframe structure from the power module design. Instead of using a patterned metal substrate with leadframe, the invention employs a support with integrated contact areas that directly receive and electrically connect the power devices, removing the complex leadframe routing and associated parasitic inductances while maintaining reliable electrical connections.
Solution Approach 2:
The patent merges the support structure with the electrical connection function. The support integrates mechanical holding and electrical connection capabilities through contact areas that directly interface with power device terminals, eliminating the separate leadframe component and simplifying the overall layout while reducing parasitic elements.
2Reliability
If clearance isolation distances are maintained for safety, then electrical insulation is ensured, but module dimensions cannot be reduced
Solution Approach 1:
The patent utilizes the vertical dimension by implementing a three-dimensional arrangement of power devices and connections. The support structure enables stacking and vertical routing of electrical connections, allowing clearance distances to be maintained in horizontal planes while minimizing overall module footprint through efficient use of vertical space.
3Ease of manufacture
If fixed leadframe structure is used, then manufacturing is simplified, but adaptability to specific design requirements is limited
Solution Approach 1:
The patent creates a universal support structure with standardized contact areas that can accommodate different power device configurations and connection requirements. The modular contact area design allows the same support structure to be adapted for various half-bridge topology variations and specific design needs, maintaining manufacturing simplicity while enhancing design versatility.
Data Source
AI summary
A power module includes a support, a first control contact area on the support, a second control contact area on the support, a first electronic power device, a second electronic power device, a first clip, a second clip, a third clip, and a package embedding the support, the first and the second electronic power devices as well as partially the first, the second and the third clips. The first electronic power device has a first conduction pad electrically coupled to the first clip, a second conduction pad electrically coupled to the third clip, and a control pad coupled to the first control contact area. The second electronic power device has a first conduction pad electrically coupled to the third clip, a second conduction pad electrically coupled to the second clip, and a control pad coupled to the second control contact area.