Integrated Clip Lead Frame for Low-Resistance MOSFET Packaging
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing lead frame arrangements for semiconductor devices result in increased connection resistance between the semiconductor die and external leads, leading to higher device resistance and potential performance issues in applications like MOSFETs.
Innovation Solution
The implementation of a clip frame structure with a continuous and merged lead portion, which maximizes the width of the lead portion to reduce spreading resistance and minimize inductance, thereby enhancing current handling and reducing on-resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a solder connection is used to connect the clip member to external leads, then mechanical bonding is achieved, but connection resistance increases
Solution Approach 1:
The invention extracts and eliminates the solder connection layer from the electrical path between the clip member and external leads. By using a direct metallurgical bond through the lead frame structure, the harmful solder interface is removed, thereby reducing connection resistance while maintaining mechanical strength through the integrated lead frame design.
Solution Approach 2:
The lead frame itself acts as an intermediary element that provides both mechanical support and electrical connection between the clip member and external leads. This eliminates the need for a separate solder joint, as the lead frame structure serves dual functions of structural support and low-resistance electrical pathway.
2Reliability
If the lead portion width is increased to reduce spreading resistance, then connection resistance decreases, but device complexity increases
Solution Approach 1:
The invention merges the lead portion with the clip member and external leads into a continuous, integrated structure. This unified design allows the lead portion to be optimized for width and electrical performance without requiring separate components or complex assembly steps, thereby reducing device complexity while achieving low spreading resistance.
Solution Approach 2:
The lead frame structure is designed to perform multiple functions simultaneously: it provides mechanical support, establishes electrical connections, and optimizes current distribution through its geometric design. This multi-functionality eliminates the need for additional components, reducing overall device complexity while achieving the desired electrical performance.
Data Source
Figure 1a~1b
Figure 2a~2b
Figure 3~4
AI summary
This disclosure relates to a lead frame assembly for a semiconductor device, a semiconductor device and associated method of manufacture, wherein the lead frame assembly comprises: a die attach structure and a clip frame structure, the clip frame structure comprising: a die connection portion configured for contacting a contact terminal on a top side of the semiconductor die; and a continuous lead portion extending along the die connection portion; wherein the continuous lead portion is integrally formed with the die connection portion.