Clip Module with Cam Surface for Heat Sink Attachment
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Solution Overview
Problem
Conventional clip modules for heat-dissipation devices often interfere with surrounding electronic components due to their eccentric mechanism, which increases the rotation radius and requires a longer fastener, making it difficult to securely attach a heat sink to a heat source without obstructing other components in limited spaces.
Innovation Solution
A clip module with a guiding groove and sliding guiding portion that allows for a shorter press stroke, enabling the heat sink to be firmly attached with a shorter fastener, reducing interference with other components by allowing the pressing structure to rotate and slide within the groove, thus minimizing the height of the fastener and avoiding collisions with nearby electronics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If an eccentric mechanism is used for the pressing structure, then the pressing stroke is increased, but the rotation radius is increased and interference with surrounding electronic components occurs
Solution Approach 1:
Instead of using an eccentric mechanism where the rotation center is offset to create pressing stroke, this patent inverts the approach by using a central pivot point and creating pressing stroke through a cam surface that converts rotational motion into linear pressing motion. The pressing structure rotates around the fastener's central axis while the cam surface profile determines the pressing stroke, eliminating the need for eccentric positioning.
Solution Approach 2:
The patent introduces a cam surface dimension to the pressing structure, where the pressing stroke is determined by the cam surface profile rather than the rotation radius. This allows the pressing structure to rotate within a small radius while still achieving sufficient pressing stroke through the cam surface's vertical dimension, thereby avoiding interference with surrounding components.
2Length of moving object
If the rotation radius is increased to provide pressing stroke, then the fastener height must be increased, but the space around the heat sink is limited
Solution Approach 1:
Instead of increasing fastener height to accommodate larger rotation radius, this patent inverts the approach by using a cam surface mechanism where the pressing stroke is derived from the cam surface profile rather than the rotation radius. This allows sufficient pressing stroke to be achieved with a compact fastener height that fits within the limited space around the heat sink.
Solution Approach 2:
The patent employs a dynamic cam surface mechanism where the pressing stroke is variable and determined by the cam surface geometry rather than a fixed rotation radius. This allows the pressing structure to achieve the required pressing stroke through the cam surface's dynamic profile while maintaining a compact overall height that accommodates the limited space constraints.
3Reliability
If a longer fastener is used to accommodate the pressing structure rotation, then the attachment is more secure, but the fastener may collide with nearby electronic components
Solution Approach 1:
Instead of relying on long fastener height to provide pressing stroke, this patent inverts the approach by using a cam surface mechanism where attachment security is achieved through the cam surface's mechanical advantage and friction, not through fastener length. This allows secure attachment while keeping the fastener height short enough to avoid colliding with nearby electronic components.
Solution Approach 2:
The cam surface acts as an intermediary between the rotating pressing structure and the heat sink, transferring and amplifying the pressing force. This intermediary mechanism allows secure attachment to be achieved through force multiplication rather than through long fastener engagement, thereby avoiding collision with nearby components.
Data Source
AI summary
A clip module and heat-dissipation device having the same is disclosed. The heat-dissipation device includes a retention module (RM) disposed on a circuit board having a heat-source, a heat sink disposed on the heat-source, and a clip module. The clip module is across in the heat sink and is clipped with the RM. The clip module includes a body, a fastener, and a pressing structure. One end of the body is clipped with the RM, and the heat sink is pressed on the heat-source by the body. The fastener is disposed in the other end of the body. One end of the fastener is clip with the RM, and a guiding portion is disposed in the other end of the fastener. The guiding portion is slid in a guiding groove of the pressing structure, so that the pressing structure is connected with the fastener.


