Power Semiconductor Clip Package Without Wire Bonds

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Solution Overview

Problem

Existing TO-263 discrete power semiconductor packages fail to meet the high humidity and mechanical stress requirements of automotive and aviation applications, and they exhibit low heat dissipation and are unidirectional, failing to meet the bidirectional needs of some customers.

Innovation Solution

A dual gauge lead frame design with a heatsink, chip tray platform, flange, and clip that secures the semiconductor chip, providing moisture protection and efficient heat dissipation, and supports both unidirectional and bidirectional devices without wire bonding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If wire bonding process is used to meet AEC Q101 standard, then reliability is improved, but heat dissipation speed deteriorates

Engineering Contradiction:

ImprovereliabilityVSAvoidheat dissipation speed

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The patent removes the wire bonding process entirely from the package structure. Instead of using wire bonds to connect the semiconductor chip to the leads, the invention uses direct metallurgical bonding between the chip pads and the lead frame, eliminating the intermediate wire bonding step that hindered heat dissipation while maintaining electrical connectivity and reliability.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent merges the electrical connection function and thermal conduction path into a single integrated structure. The lead frame serves dual purposes as both electrical terminal and heat dissipation pathway, with direct metal-to-metal bonding between chip and leads creating both electrical and thermal continuity, eliminating the need for separate wire bonds.

Inventive Principle:

Principle #5Merging (Combining)

2Adaptability or versatility

If wire bonding process is used, then bidirectional capability is lost, but manufacturing simplicity is improved

Engineering Contradiction:

Improvebidirectional capabilityVSAvoidmanufacturing simplicity

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent creates a universal package structure that can accommodate both unidirectional and bidirectional semiconductor devices through the same direct-bonding architecture. The lead frame design with multiple pads allows flexible electrical connectivity configurations, enabling the same manufacturing process to produce packages suitable for various device types including bidirectional switches required in automotive applications.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Adaptability or versatility

If conventional TO-263 package is used, then commercial application compatibility is improved, but automotive and aviation reliability standards are not met

Engineering Contradiction:

Improveapplication compatibilityVSAvoidhumidity resistance

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The patent applies local quality improvements to specific critical areas of the package. The lead frame incorporates enhanced plating layers and sealed structures at the bonding interfaces and periphery where moisture ingress is most likely to occur. These localized enhancements provide superior moisture and corrosion resistance at critical stress points while maintaining the overall TO-263 form factor for application compatibility.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent employs composite material structures in the lead frame, combining different metal alloys and protective plating layers to achieve both mechanical strength and corrosion resistance. The multi-layer construction includes corrosion-resistant coatings and sealed metallic barriers that protect internal bonding interfaces from humidity while maintaining electrical conductivity and thermal performance.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design enhances reliability and heat dissipation, meeting automotive and aviation standards by protecting against mechanical stress and humidity while supporting both unidirectional and bidirectional semiconductor chips.

Implementation Method 1

The heatsink is adjacent the semiconductor chip and draws heat away from the semiconductor chip

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12532750B2Clip for a discrete power semiconductor package

Publication Date: 2026.01.20 LITTELFUSE SEMICON WUXI

AI summary

A discrete power semiconductor package includes a semiconductor chip, a heatsink, a first lead, a second lead, and a clip. The heatsink is adjacent the semiconductor chip and draws heat away from the semiconductor chip. The clip binds the semiconductor chip to the heatsink and includes a chip linker, a first terminal, and a second terminal. The chip linker is atop the semiconductor chip. The first terminal connects to the first lead and the second terminal connects to the second lead.