Semiconductor Package Clip-Spacer Interconnect for Top-Side Cooling
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Solution Overview
Problem
The increasing densification of power electronics, particularly in silicon carbide (SiC) technology, leads to heat transport issues, with surface temperatures exceeding the melting point of aluminum and mold compound cracking due to inadequate cooling, especially on the top side of semiconductor packages, where design limitations restrict effective heat dissipation.
Innovation Solution
A semiconductor package design incorporating a conductor element laterally overlapping the contact pad, connected via electrically conductive spacers and adhesive systems to a clip or leadframe, utilizing short ball bonds and a low-inductive clip with a large cable cross-section for efficient heat transfer and reduced parasitic capacitance, allowing for faster heat dissipation and high switching performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If chip shrinkage is implemented to increase power density, then cost and performance are improved, but heat transport capability deteriorates
Solution Approach 1:
The patent transitions from conventional bottom-side-only cooling to a three-dimensional cooling architecture by introducing top-side cooling elements (CCP, CCE, CCC) that extend the heat dissipation pathway into the vertical dimension. This allows heat to be extracted from both the top and bottom surfaces of the chip, effectively doubling the heat transport capability without increasing the chip footprint area.
Solution Approach 2:
The cooling structure implements a nested configuration where the first cooling element (CCP) is positioned at the top surface, the second cooling element (CCE) is embedded within the mold compound, and the third cooling element (CCC) is integrated into the leadframe. This nested arrangement allows multiple cooling functions to be stacked vertically, maximizing heat dissipation efficiency within a compact package volume.
2Temperature
If top-side cooling elements are added to improve heat dissipation, then heat transport capability is improved, but device complexity increases
Solution Approach 1:
The leadframe structure serves multiple functions simultaneously: it provides electrical interconnection for the semiconductor device and acts as the third cooling element (CCC) for heat dissipation. The mold compound serves both as encapsulation material and as the matrix for embedding the second cooling element (CCE). This multi-functionality reduces the need for additional separate cooling components, thereby limiting the increase in device complexity.
3Temperature
If thick leadframes are used to improve bottom-side cooling, then heat transport capability is improved, but package volume increases
Solution Approach 1:
Instead of uniformly increasing leadframe thickness throughout the entire package, the patent concentrates the cooling function at specific locations where heat generation is highest. The third cooling element (CCC) is strategically positioned to contact the semiconductor chip's bottom surface at the heat-generating region, providing localized intensive cooling without requiring a proportional increase in overall package volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables effective heat transfer and high switching performance while reducing thermal resistance, enabling a smaller chip size and cost-efficient manufacturing with reduced thermal stress and parasitic capacitance, thus addressing the heat dissipation challenges in densely packed power electronics.
Implementation Method 1
enables effective heat transfer and high switching performance while reducing thermal resistance
Implementation Method 2
a first adhesive system configured to electrically and mechanically connect the at least one electrically conductive spacer with the contact pad, and a second adhesive system configured to electrically and mechanically connect the at least one electrically conductive spacer with the conductor element
Data Source
AI summary
A semiconductor package is provided. The semiconductor package may include at least one semiconductor chip including a contact pad configured to conduct a current, a conductor element, wherein the conductor element is arranged laterally overlapping the contact pad and with a distance to the contact pad, at least one electrically conductive spacer, a first adhesive system configured to electrically and mechanically connect the at least one electrically conductive spacer with the contact pad, and a second adhesive system configured to electrically and mechanically connect the at least one electrically conductive spacer with the conductor element, wherein the conductor element is electrically conductively connected to a clip or is at least part of a clip, and wherein the spacer is configured to electrically conductively connect the contact pad with the laterally overlapping portion of the conductor element.