Multi-Layer Clip Structure for Semiconductor Package Assembly
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Solution Overview
Problem
Conventional semiconductor packages using metallic wires face issues with slow stack package speed, degradation in electric properties, increased package size, and difficulty in controlling the amount of solder or conductive adhesive for adhesion, leading to suboptimal quality and efficiency.
Innovation Solution
A clip structure comprising multiple layers of different metals, including a main metallic layer and a self-welding or conductive functional layer, which allows for precise adhesion and thermal management, reducing the need for solder or conductive adhesive and enhancing the quality and efficiency of semiconductor package assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional metallic wires are used for electrical connection, then the package can be assembled, but the stack package speed is slow and electric properties degrade
Solution Approach 1:
The patent replaces conventional metallic wire bonding with a clip structure that uses mechanical clamping force to establish electrical connections. The clip structure applies pressure through its contact surfaces to create conductive pathways between chips and substrates, eliminating the need for wire bonding processes and thereby increasing package speed while maintaining electrical performance
Solution Approach 2:
The clip structure is constructed as a multi-layer composite material system with each layer serving specific functions: the first layer provides self-welding capability for strong adhesion, the second layer ensures low electrical resistance for signal integrity, and the third layer offers mechanical strength and shape stability. This composite structure simultaneously achieves high productivity and reliable electric properties
2Ease of manufacture
If solder or conductive adhesive is used for adhesion, then the clip structure can be connected to lead frame or semiconductor chip, but it is difficult to exactly control the amount of solder or adhesive
Solution Approach 1:
The first functional layer of the clip structure is designed with self-welding properties that enable it to automatically bond with the lead frame or semiconductor chip surface without requiring external solder or adhesive materials. The self-welding mechanism occurs through controlled heating or pressure during the assembly process, allowing the clip structure to create its own secure connection while eliminating the need for precise solder or adhesive application
Solution Approach 2:
The invention extracts and removes the solder or conductive adhesive from the connection process by replacing it with the self-welding functional layer. This elimination of external bonding materials simplifies the manufacturing process and completely resolves the issue of controlling the amount of solder or adhesive, as no such materials are used in the final connection method
3Device complexity
If a single metal clip structure is used, then the structure is simple, but the adhesion quality and thermal management are insufficient
Solution Approach 1:
The clip structure is designed as a multi-layer composite material system where each layer is made of different metals or materials optimized for specific functions. The first functional layer provides self-welding capability for strong adhesion, the second functional layer ensures low electrical resistance, and the main metallic layer provides mechanical strength and shape stability. This composite structure simultaneously achieves high adhesion quality, reliable electrical connection, and effective thermal management
Solution Approach 2:
Different regions and layers of the clip structure are assigned different material properties to optimize local functions. The first functional layer is specifically designed with self-welding properties for optimal adhesion to the chip or lead frame surface, while the main metallic layer is designed with high thermal conductivity for heat dissipation. This localized optimization of material properties ensures that each part of the structure performs its intended function at the highest level
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The multi-layer clip structure improves adhesion quality, reduces package weight, and simplifies the assembly process by enabling precise control over adhesive application, while enhancing thermal conductivity and radiation, thus improving the credibility and efficiency of semiconductor packages.
Implementation Method 1
a first functional layer that is piled on one surface of the main metallic layer and consists of a metal different from that of the main metal layer... The first functional layer may be a self-welding layer having a melting point lower than that of the main metallic layer
Data Source
AI summary
A clip structure and a semiconductor package using the same include different metals in multiple layers so as to selectively, easily and exactly fix semiconductor chips, which consists of a lightweight material so as to lighten the weight of semiconductor packages and to help reduce manufacturing costs, and which in particular, maintains the width of a self-welding layer consisting of a clip structure so as to help improve the quality of adhesion. That is, according to a clip structure of the present invention, which electrically connects package elements in a semiconductor package, the clip structure includes a main metallic layer that is configured to maintain a shape, and a first functional layer that is piled on one surface of the main metallic layer and consists of a metal different from that of the main metal layer.