Closed Cooling Loop with Dielectric Fluid for High-Power Rack Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current liquid cooling systems for data centers are inefficient and costly due to high water requirements, pressure and flow demands, and structural weight issues, especially in high-power computing environments where heat dissipation exceeds 50-100 kW per rack.
Innovation Solution
A closed cooling loop system using a dielectric fluid that circulates through a network of tubing connected to processors, allowing for phase-change cooling with a lower flow rate and reduced system size, weight, and cost, while maintaining efficient heat transfer and compatibility with various environments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional liquid cooling systems use water and copper cold plates, then heat dissipation can be achieved, but the system requires high water flow rates and creates excessive structural weight
Solution Approach 1:
The patent changes the physical parameters of the cooling system by using dielectric fluid instead of water, enabling operation at lower flow rates (e.g., 10-50 mL/min vs. traditional higher rates) while maintaining effective heat dissipation from processors in high-power computing racks
Solution Approach 2:
The system employs composite construction with aluminum cold plates instead of traditional copper, combined with dielectric fluid, creating a lighter yet thermally effective cooling system that reduces overall weight while maintaining heat transfer efficiency
2Temperature
If conventional liquid cooling systems increase water flow rate to cool high-power racks, then heat dissipation improves, but system complexity and cost increase
Solution Approach 1:
The patent reduces the operating flow rate parameter to 10-50 mL/min, which simplifies the pumping system requirements, reduces conduit sizing, and lowers overall system complexity while effectively cooling high-power computing racks that traditionally required complex high-flow systems
3Temperature
If conventional liquid cooling systems use copper components, then heat transfer efficiency is maintained, but corrosion and inter-metallic compatibility issues arise
Solution Approach 1:
The patent changes the material parameter from copper to aluminum for cold plates, combined with using dielectric fluid instead of water, which eliminates corrosion and inter-metallic compatibility issues while maintaining effective heat transfer efficiency through the aluminum-dielectric fluid interface
Solution Approach 2:
The dielectric fluid serves as an intermediary cooling medium that is chemically compatible with aluminum components, preventing direct corrosive interaction between coolant and metal surfaces while still enabling efficient heat extraction from processors
4Temperature
If conventional liquid cooling systems are used for high-power racks, then cooling capacity is achieved, but continuous monitoring and correction of fluid properties are required
Solution Approach 1:
The dielectric fluid in the closed-loop system is self-sustaining with no requirement for continuous monitoring or correction of fluid properties such as pH, conductivity, or contamination levels, eliminating the operational burden of maintaining coolant quality while providing reliable cooling capacity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The closed cooling loop system achieves high thermal performance with lower flow rates, reduced system size and weight, and increased reliability, enabling efficient heat management in high-power computing environments without the need for continuous monitoring and correction of fluid properties.
Implementation Method 1
allowing for phase-change cooling
Implementation Method 2
a liquid portion of the dielectric fluid is to evaporate from the processor heat absorbed by the dielectric fluid
Implementation Method 3
a vapor portion of the dielectric fluid is to condense from the heat removed by the coolant flow
Data Source
AI summary
The present disclosure describes embodiments of apparatuses and methods related to a computing apparatus with a closed cooling loop thermally coupled to one or more processors disposed on a circuit board of the computing apparatus. The closed cooling loop circulates a dielectric fluid to absorb heat from the processor. A portion of the dielectric fluid is evaporated from the processor heat absorbed by the dielectric fluid. A heat exchanger is coupled to the circuit board and thermally coupled to the closed cooling loop. The heat exchanger is to include a coolant flow to remove heat from the dielectric fluid circulated through the portion of the closed cooling loop thermally coupled to the heat exchanger. A vapor portion of the dielectric fluid is condensed from the heat removed by the coolant flow. Other embodiments may be described and/or claimed.