Closed-Core Inductor Assembly Layout for Higher PCB Density
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electronic circuit devices face challenges in achieving high inductor density due to limited space on printed circuit boards, especially with high-Q inductors, leading to inefficient use of board area and mechanical constraints.
Innovation Solution
An inductor assembly design featuring a toroidally-shaped core inductors mounted in side-by-side relation with elongate members extending through medial openings, using castellated vias for interconnection and spacers for spacing, allowing compact high-Q inductor arrays on a main circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If surface-mounted closed-core inductors are placed on a printed circuit board, then inductors can be mounted and connected, but they require a relatively large printed circuit board area reducing inductor density
Solution Approach 1:
The inductors are mounted in side-by-side relation with their lower portions extending into a through-opening of the circuit board, nesting the inductor assembly within the board structure rather than placing them on the surface. This allows multiple inductors to be packed more densely within the available board area.
Solution Approach 2:
The invention transitions from surface-mount technology (2D placement on board surface) to a through-board mounting approach where inductors extend into the board thickness dimension. The lower portions of inductors extend into the through-opening while upper portions remain accessible for connection, utilizing the third dimension (board thickness) to increase packing density.
2Quantity of substance
If larger arrays of multiple inductors are placed on a printed circuit board, then more inductors can be mounted, but there is often unused space between them which is inefficient
Solution Approach 1:
Multiple inductors are nested within a single through-opening in the circuit board, with their lower portions extending into the opening and their upper portions arranged in side-by-side relation. This nesting approach eliminates unused space between inductors by packing them tightly within the constrained through-opening area.
Solution Approach 2:
Multiple inductors are combined within a single through-opening structure, sharing the common space of the opening rather than requiring separate mounting areas for each inductor. This merging of multiple inductors into a shared structural space maximizes the utilization of the board area.
3Adaptability or versatility
If high-Q inductors are mounted on a VPX card with limited height and width, then the card can function, but the limited board space restricts inductor placement options
Solution Approach 1:
The through-opening mounting approach utilizes the vertical dimension (board thickness) to accommodate inductors, freeing up the limited horizontal board space on the VPX card. This dimensional transition allows inductors to be placed without consuming excessive surface area, adapting to the constrained form factor of VPX cards.
Solution Approach 2:
Inductors are nested within the through-opening of the VPX card, utilizing the card's structural thickness to house the inductor assembly. This nesting approach allows high-Q inductors to be mounted on space-constrained VPX cards without requiring additional horizontal space beyond the through-opening footprint.
Data Source
AI summary
An electronic circuit device may include a main circuit board having an inductor assembly mounting area thereon, and an inductor assembly coupled to the main circuit board adjacent the inductor assembly mounting area. The inductor assembly may include an inductor assembly circuit board with an inductor assembly circuit board though-opening therein, and closed-core inductors coupled to the inductor assembly circuit board in side-by-side relation and having lower portions extending into the inductor assembly circuit board though-opening.