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Solution Overview

Problem

Turbulent air flow and high relative humidity in semiconductor processing environments can lead to contamination and oxidation of wafers, resulting in defects and reduced manufacturing yield.

Innovation Solution

A closed gas circulation system with a sealed plenum, circulation fans, air-flow rectifier, and vacuum pumps is implemented to provide a collimated downflow of gas, reducing turbulence and controlling humidity and oxygen levels, thereby minimizing contamination and oxidation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If a closed gas circulation system with sealed plenum is implemented, then contamination collection efficiency is enhanced and wafer oxidation is reduced, but device complexity increases

Engineering Contradiction:

Improvewafer contamination and oxidationVSAvoidgas circulation system complexity

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The gas circulation system is segmented into distinct functional zones: a sealed plenum chamber for gas storage and pressure regulation, a distribution manifold for even gas delivery, and a chamber environment control system. This segmentation allows each component to be optimized independently for its specific function while collectively reducing wafer contamination.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The sealed plenum acts as an intermediary component between the external environment and the wafer processing chamber. It provides a buffer zone that regulates gas flow and maintains stable pressure conditions, preventing direct exposure of wafers to turbulent or contaminated air flows while simplifying the overall system architecture.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If circulation fans and vacuum pumps are used to control gas flow, then humidity and oxygen levels are controlled, but energy consumption increases

Engineering Contradiction:

Improveenvironmental condition controlVSAvoidenergy consumption of gas circulation components

Core Design Contradiction:

ReliabilityVSUse of energy by moving object

Solution Approach 1:

The circulation fans operate continuously to maintain steady gas flow patterns and stable environmental conditions within the chamber. This continuous operation ensures consistent humidity and oxygen level control, preventing defects while optimizing energy efficiency through sustained, low-power operation rather than intermittent high-power cycles.

Inventive Principle:

Principle #20Continuity of useful action

Solution Approach 2:

The system dynamically adjusts gas flow parameters and circulation rates based on real-time environmental monitoring. By changing flow parameters only when necessary to maintain target humidity and oxygen levels, the system achieves reliable environmental control while minimizing energy consumption of the circulation components.

Inventive Principle:

Principle #35Parameter changes

3Manufacturing precision

If a collimated downflow of gas is implemented, then turbulence is reduced and contamination is minimized, but manufacturing complexity increases

Engineering Contradiction:

Improvewafer processing qualityVSAvoidgas flow control system complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The gas distribution system creates locally optimized flow patterns with collimated downflow directly over the wafer processing areas while allowing different flow characteristics in other chamber regions. This local quality approach minimizes turbulence and contamination at critical locations without requiring complex flow control throughout the entire chamber, simplifying the overall system design.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances contamination collection efficiency, reduces wafer defects, increases yield, and improves productivity by maintaining precise environmental conditions within the processing chamber.

Implementation Method 1

A closed gas circulation system with a sealed plenum, circulation fans, air-flow rectifier, and vacuum pumps is implemented to provide a collimated downflow of gas, reducing turbulence

Methodology Applied

Scientific EffectLaminar flow: Laminar Flow

Implementation Method 2

Methodology Applied

Scientific EffectGravitational convection: Gravitational Convection (non heat)

Implementation Method 3

A closed gas circulation system with a sealed plenum, circulation fans, air-flow rectifier, and vacuum pumps is implemented to provide a collimated downflow of gas

Methodology Applied

Scientific EffectForced convection: Forced Convection

Data Source

PatentUS11854851B2Interface tool

Publication Date: 2023.12.26 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A closed gas circulation system may include a sealed plenum, circulation fans, and a fan filter unit (FFU) inlet to contain, filter, condition, and re-circulate a gas through a chamber of an interface tool. The gas provided to the chamber is maintained in a conditioned environment in the closed gas circulation system as opposed to introducing external air into the chamber through the FFU inlet. This enables precise control over the relative humidity and oxygen concentration of the gas used in the chamber, which reduces the oxidation of semiconductor wafers that are transferred through the chamber. The closed gas circulation system may also include an air-flow rectifier, a return vent, and one or more vacuum pumps to form a downflow of collimated gas in the chamber and to automatically control the feed-forward pressure and flow of gas through the chamber and the sealed plenum.