Closed-Logo Slit Heatsink for High-Intensity Phosphor Stability

The patent introduces a specialized heatsink structure as an intermediary thermal management component between the laser diode and the phosphor converter. This heatsink with closed-logo slits acts as a mediator that facilitates efficient heat transfer from the high-power-density laser source to the surrounding environment, enabling the system to operate at high intensities without thermal degradation of the phosphor material's spectral stability

The patent modifies the thermal conductivity parameter by using specific heatsink materials and optimizing the thermal interface between components. By changing the thermal parameters of the heat dissipation path (through material selection and geometric design of the heatsink), the system can maintain stable operating temperatures even at high power densities, thus preserving spectral stability while achieving high light intensity

The specialized heatsink structure serves as a thermal intermediary that decouples the high-power optical operation from thermal effects on the phosphor material. By providing a dedicated thermal management pathway, the heatsink allows the luminescent material to operate in a stable temperature regime even when the system generates high light intensity, thereby maintaining reliability and spectral stability

The patent implements preliminary thermal management by pre-designing the heatsink structure with optimized heat dissipation pathways before the high-power operation begins. The closed-logo slit geometry is预先 configured to establish effective thermal conduction and convection paths, ensuring that temperature-dependent reliability issues are prevented before they can occur during operation

The patent employs asymmetric closed-logo slit geometry in the heatsink design, where the slit pattern is specifically configured to be transparent or open in directions that allow light extraction while maintaining thermal management functionality. This asymmetric design breaks the symmetry between thermal conduction paths and optical paths, enabling simultaneous optimization of both heat dissipation and light extraction efficiency

The heatsink structure implements local quality differentiation by having regions with different optical and thermal properties. The closed-logo slits create localized transparent zones that permit light passage while the surrounding solid heatsink material provides thermal management. This spatial variation in material properties allows the single component to fulfill both thermal and optical functions effectively