Closed-Loop Cryogen Cooling for Computing Hardware Condensation Control
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Solution Overview
Problem
Current cryogenic cooling systems for processing circuitry are inefficient due to being open-loop, leading to rapid cryogen depletion, condensation issues, lack of temperature control, and scalability limitations, which can damage components and limit performance gains.
Innovation Solution
A closed-loop computing system with a cryogen evaporator plate and distribution system that recaptures and reuses evaporated cryogen, providing precise temperature control and scalable cooling by thermally coupling the cryogen evaporator plate to processing circuitry and distributing evaporated cryogen to additional components within a sealed housing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If pot-based cooling systems are used to cool processing circuitry, then the processing circuitry can be cooled to achieve significant performance gains, but the cryogen must be constantly replenished due to evaporation loss
Solution Approach 1:
The patent implements a closed-loop system where evaporated cryogen is captured and condensed back to liquid form through heat exchangers. The condensed cryogen is then returned to the storage tank for reuse, eliminating the need for constant replenishment and recovering the substance that would otherwise be lost through evaporation.
2Temperature
If pot-based cooling systems are used, then processing circuitry can be cooled effectively, but condensation forms around the pot and processing circuitry causing electrical shorts
Solution Approach 1:
The patent extracts and removes moisture from the environment surrounding the processing circuitry using desiccants and heated air circulation systems. This prevents condensation formation on cold surfaces by actively removing water vapor from the air in the sealed enclosure.
Solution Approach 2:
The system applies preliminary anti-action by heating air circulation and using desiccant materials before condensation can form on the cooled surfaces. This preventive approach counteracts the tendency toward condensation by maintaining the surrounding air temperature and humidity levels above the dew point.
3Temperature
If pot-based cooling systems are used, then processing circuitry can be cooled, but there is very little control over the temperature resulting in freezing of the processing circuitry
Solution Approach 1:
The patent implements feedback control through temperature sensors that continuously monitor the processing circuitry temperature and feed this information to a control system. The control system adjusts the cryogen flow rate and heat exchanger operation to maintain the temperature within a safe operating range, preventing both overheating and freezing conditions.
Solution Approach 2:
The system transitions from a static pot-based approach to a dynamic controlled system where cryogen flow rates, heat exchanger temperatures, and air circulation are continuously adjusted based on real-time temperature measurements. This dynamic control enables precise temperature management and prevents the processing circuitry from freezing.
4Temperature
If pot-based cooling systems are used, then processing circuitry can be cooled, but the systems are not scalable
Solution Approach 1:
The patent segments the cooling system into modular components including separate storage tanks, evaporator units, heat exchangers, and control modules. This modular architecture allows the system to be scaled by adding or removing modules to match the thermal requirements of different numbers and types of processing circuitry units.
Solution Approach 2:
The patent designs a universal cooling platform that can serve multiple functions and configurations. The same basic architecture with modular components can cool different types of processing circuitry at various power levels and thermal densities, making the system adaptable and scalable across different application scenarios.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables reliable, long-term cooling of processing circuitry and additional components with precise temperature control, preventing damage from condensation and allowing for scalable deployment, enhancing performance and efficiency.
Implementation Method 1
cool the processing circuitry using the cryogen such that the cryogen is evaporated during the cooling of the processing circuitry to provide evaporated cryogen
Implementation Method 2
The cryogen distribution system is configured to recover the evaporated cryogen via the cryogen output port, process the evaporated cryogen to provide the cryogen
Data Source
AI summary
A computing system includes a housing, processing circuitry, one or more additional components, and a cryogen evaporator plate. The housing includes a cryogen input port, a cryogen output port, and an interior chamber. The processing circuitry and the one or more additional components are in the interior chamber of the housing. The cryogen evaporator plate is thermally coupled to the processing circuitry and configured to receive a cryogen via the cryogen input port, cool the processing circuitry using the cryogen such that the cryogen is evaporated during the cooling of the processing circuitry to provide evaporated cryogen, and provide the evaporated cryogen into the interior chamber of the housing such that the evaporated cryogen is distributed over the one or more additional components to cool the one or more additional components.