Closed-Loop Cryogen Cooling for Computing Hardware Temperature Control
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Solution Overview
Problem
Existing cryogenic cooling systems for processing circuitry are open-loop, leading to constant replenishment needs, condensation issues, lack of temperature control, and scalability limitations, which can damage components and hinder performance.
Innovation Solution
A closed-loop cryogenic cooling system with a cryogen distribution system that recaptures and processes evaporated cryogen, uses a heating element for precise temperature control, and is scalable, incorporating a cryogen evaporator plate and distribution system within a sealed housing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional cooling methods (underfloor trays, overhead plenums) are used, then cooling capability is limited, but device complexity and space requirements increase
Solution Approach 1:
The patent combines the cooling function with the existing rack structure by integrating cooling fins directly into the rack framework. This merging eliminates the need for separate cooling systems while providing effective thermal management through the rack's own structural elements.
Solution Approach 2:
The rack structure serves dual purposes: supporting computing equipment and providing cooling functionality through integrated fins. This multi-functionality allows the same structure to perform both mechanical support and thermal management, reducing overall system complexity.
2Temperature
If more cooling infrastructure is added, then cooling effectiveness improves, but installation space requirements increase
Solution Approach 1:
The patent transitions from horizontal cooling approaches (underfloor trays, overhead plenums) to vertical cooling by extending fins upward from the rack base. This dimensional change allows cooling functionality to be achieved within the vertical space already occupied by the rack, without requiring additional horizontal installation area.
Solution Approach 2:
The cooling fins are nested within the rack structure itself, using the rack's vertical space and framework. This nesting approach allows the cooling system to be contained within the existing rack footprint, maximizing cooling effectiveness without increasing overall space requirements.
3Temperature
If cooling fins are added to racks, then cooling effectiveness improves, but manufacturing complexity increases
Solution Approach 1:
The patent specifies optimal fin parameters (spacing of 0.5-2 inches, height of 6-18 inches) that balance cooling effectiveness with manufacturability. These parameter ranges are chosen to achieve good thermal performance while remaining practical for standard manufacturing processes and materials.
Solution Approach 2:
The cooling fins are concentrated at the base of the rack where heat generation is highest, providing localized cooling where it is most needed. This local quality approach focuses manufacturing effort on the most critical thermal management area rather than requiring complex cooling throughout the entire rack structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Provides reliable, long-term cooling with precise temperature control, preventing component damage and enabling scalability, with a coefficient of performance (CoP) greater than or equal to five.
Implementation Method 1
a first set of cooling fins of the first rack extending from a base of the first rack in a downward direction
Implementation Method 2
a first set of cooling fins of the first rack extending from a base of the first rack in a downward direction
Data Source
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AI summary
A computing system includes a housing, processing circuitry, one or more additional components, and a cryogen evaporator plate. The housing includes a cryogen input port, a cryogen output port, and an interior chamber. The processing circuitry and the one or more additional components are in the interior chamber of the housing. The cryogen evaporator plate is thermally coupled to the processing circuitry and configured to receive a cryogen via the cryogen input port, cool the processing circuitry using the cryogen such that the cryogen is evaporated during the cooling of the processing circuitry to provide evaporated cryogen, and provide the evaporated cryogen into the interior chamber of the housing such that the evaporated cryogen is distributed over the one or more additional components to cool the one or more additional components.