Closed-Loop Hybrid Cooling for Leak-Resistant Processor Operation
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Solution Overview
Problem
Existing cooling solutions for electronic devices are inadequate to manage the increased thermal energy generated by high-performance components, necessitating improved thermal management systems.
Innovation Solution
A hybrid cooling system combining air and liquid cooling methods, utilizing a hybrid cooling plate, radiator, and fans to efficiently transfer heat from CPUs and GPUs, with a working fluid and pump system to enhance thermal energy rejection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a liquid cooling system is used to cool high-performance electronic components, then the cooling capacity and efficiency are improved, but the risk of component damage from leaks increases
Solution Approach 1:
The patent introduces air as an intermediary cooling medium that contacts the electronic components directly, while the liquid cooling system is isolated to specific heat rejection areas. This mediator approach allows the liquid cooling benefits to be realized without the liquid directly contacting vulnerable components, thus maintaining high cooling capacity while reducing leak damage risk.
Solution Approach 2:
The cooling system is segmented into distinct air-cooled zones (direct component cooling) and liquid-cooled zones (heat rejection via radiator). This segmentation allows each subsystem to optimize its function while minimizing the downsides - air cooling provides safe direct contact with components, while liquid cooling handles the thermal rejection without exposing components to liquid.
2Productivity
If a hybrid cooling system combining air and liquid cooling is implemented, then the thermal management efficiency is improved, but the device complexity increases
Solution Approach 1:
The patent merges air cooling and liquid cooling subsystems into a unified hybrid cooling architecture where both systems work synergistically. The air cooling handles direct component thermal management while the liquid cooling system manages heat rejection, creating a combined system that achieves superior thermal management efficiency despite the increased complexity of integrating multiple cooling mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The hybrid cooling system provides enhanced thermal management, allowing higher wattage operation of CPUs and GPUs by maximizing cooling capacity and efficiency, reducing the risk of component damage from leaks, and maintaining optimal operating temperatures.
Implementation Method 1
The working fluid can be operable to receive heat from the cooling plate and reject heat at the radiator
Implementation Method 2
A hybrid cooling plate can be operably coupled with the processor socket... The working fluid can be in fluidic communication with the radiator and the hybrid cooling plate
Implementation Method 3
the one or more cooling fans can be operable to produce an airflow across the hybrid cooling plate, thereby allowing the hybrid cooling plate transfer thermal energy to the airflow
Data Source
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AI summary
A hybrid cooling server assembly can have a printed circuit board (PCB) with a processor socket disposed thereon and a hybrid cooling plate can be operably coupled with the processor socket. A radiator can having a working fluid received therein and be in fluidic communication with the radiator and the hybrid cooling plate by one or more tubular members. One or more cooling fans can be proximal to the radiator. The working fluid can be operable to receive heat from the cooling plate and reject heat at the radiator and the one or more cooling fans can be operable to produce an airflow across the hybrid cooling plate, thereby allowing the hybrid cooling plate transfer thermal energy to the airflow.