Closed-Loop Heat Dissipation Module With Liquid-Air Thermal Paths
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Solution Overview
Problem
Electronic devices, particularly display devices, generate heat during operation, which can degrade performance and reduce lifespan, necessitating efficient heat dissipation solutions.
Innovation Solution
A heat dissipation module with a first plate, partition wall, and working fluid paths, including a closed loop and exposed paths, enhances heat dissipation efficiency by utilizing liquid and air layers for thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional heat dissipation structure is used, then the device can operate, but heat dissipation efficiency is insufficient leading to performance degradation and reduced lifespan
Solution Approach 1:
The heat dissipation module is segmented into multiple functional paths: a first closed-loop path containing liquid for efficient heat absorption, a second path with air layer for heat dissipation, and a third path for additional heat dissipation. This segmentation allows each path to perform its specific heat dissipation function optimally, resolving the contradiction between temperature control and reliability.
Solution Approach 2:
The invention utilizes liquid (hydraulic) in the first closed-loop path for heat absorption and air layer (pneumatic) in the second and third paths for heat dissipation. This combination of pneumatic and hydraulic systems enables efficient thermal management, improving heat dissipation efficiency while ensuring device reliability and extended lifespan.
2Temperature
If heat dissipation efficiency is improved through complex structures, then temperature control is better, but device complexity increases
Solution Approach 1:
The invention merges multiple heat dissipation functions into a single integrated heat dissipation module. The first closed-loop path with liquid, the second path with air layer, and the third path are combined in one module, achieving efficient temperature control without proportionally increasing device complexity. The partition wall integrates the separation of these paths while maintaining a compact overall structure.
Solution Approach 2:
Different regions of the heat dissipation module have different qualities: the first path uses liquid for high-efficiency heat absorption where heat generation is highest, while the second and third paths use air layers for heat dissipation. This local differentiation of heat dissipation qualities optimizes temperature control without requiring complex structures throughout the entire device.
3Temperature
If a closed-loop liquid path is used for heat dissipation, then heat absorption efficiency is improved, but the structure becomes more complex and harder to manufacture
Solution Approach 1:
The closed-loop liquid path is segmented and integrated with air-layer paths through partition walls, allowing each section to be manufactured relatively simply and then assembled together. This segmentation reduces the manufacturing difficulty of the complete closed-loop system while maintaining high heat absorption efficiency in the liquid path.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The module effectively dissipates heat generated by display devices, improving performance and extending device lifespan through enhanced thermal management.
Implementation Method 1
a working fluid disposed in the first path
Implementation Method 2
the first path forming a closed loop; a second path spaced apart from the first path and communicating with an outside of the heat dissipation module
Data Source
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AI summary
Provided herein is a heat dissipation module including a first planar component, a partition wall coupled to the first planar component and defining a first path having one side closed by the first planar component, the first path forming a closed loop, and working fluid disposed in the first path. The heat dissipation module and an electronic device including the heat dissipation module in accordance with embodiments may be improved in heat dissipation efficiency.