Cluster Tool Swapper Layout for Faster Substrate Transfer

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Solution Overview

Problem

There is a need in the semiconductor manufacturing industry for a method to rapidly, efficiently, and cost-effectively transfer substrates from a load lock to a processing chamber in cluster tools, while also reducing the number of motors required to operate multiple robotic mechanisms.

Innovation Solution

A cluster tool design featuring a processing chamber monolithic structure with four processing chambers and four load locks, each equipped with a heater assembly, and a swapper assembly with four swappers that operate along a linear trajectory to swap substrates between processing chambers and load locks. This design uses a single motor assembly to operate all swappers simultaneously, reducing the number of motors needed.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If multiple robotic mechanisms with different motors are used to transfer substrates between chambers, then substrate transfer can be performed, but the number of motors increases and operational complexity increases

Engineering Contradiction:

Improvesubstrate transfer operationVSAvoidnumber of motors

Core Design Contradiction:

Ease of operationVSDevice complexity

Solution Approach 1:

The patent combines multiple robotic mechanisms into a single integrated robotic arm that can perform substrate transfer between multiple chambers. Instead of using separate robotic mechanisms each with their own motors, one robotic arm with multiple degrees of freedom replaces them all, reducing the total number of motors while maintaining the ability to transfer substrates between any chambers.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The robotic arm is designed as a universal mechanism that can perform multiple functions: transferring substrates between different chambers, positioning substrates at various locations, and adapting to different chamber configurations. This single multi-functional robotic arm replaces what would otherwise require multiple specialized robotic mechanisms.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Productivity

If traditional multi-step transfer methods are used, then substrates can be moved between load lock and processing chamber, but transfer time increases and throughput decreases

Engineering Contradiction:

Improvesubstrate processing throughputVSAvoidsubstrate transfer time

Core Design Contradiction:

ProductivityVSLoss of time

Solution Approach 1:

The robotic arm is pre-positioned and configured to execute optimized transfer paths between chambers. The system performs preliminary planning of substrate transfer routes and pre-positions the robotic arm for efficient movement, reducing the actual transfer time. The robotic arm can quickly move between chambers without requiring intermediate stopping or repositioning that would occur with multiple separate mechanisms.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The robotic arm enables continuous substrate transfer operations without interruption. While one substrate is being transferred, the robotic arm can simultaneously reposition itself or prepare for the next transfer operation. The integrated design eliminates idle time and waiting periods that occur when using multiple separate robotic mechanisms that must operate sequentially.

Inventive Principle:

Principle #20Continuity of useful action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The proposed solution enhances the throughput of substrate processing by eliminating the need for multiple transfer steps and reduces operational costs by minimizing the number of motors required, thereby improving the efficiency and cost-effectiveness of substrate transfer in cluster tools.

Implementation Method 1

each load lock including a heater assembly configured to increase the temperature of a substrate disposed in the load lock

Methodology Applied

Scientific EffectHeating: Heating

Implementation Method 2

a first electrode disposed in the first support; a second electrode disposed in the first support, wherein the first electrode and second electrode are configured to be energized to chuck a first substrate to the first support

Methodology Applied

Scientific EffectElectrostatic induction: Electrostatic Induction

Data Source

PatentUS20250136386A1High throughput substrate processing cluster tool

Publication Date: 2025.05.01 APPLIED MATERIALS INC

AI summary

A cluster tool for fabricating substrates includes a factory interface; a first processing mainframe coupled to the factory interface, including: a processing chamber monolithic structure including four processing chambers in the same housing; four load locks coupled to the processing chamber monolithic structure, each load lock including a heater assembly configured to increase the temperature of a substrate disposed in the load lock; and a swapper assembly disposed between the four load locks and the processing chamber monolithic structure, wherein the swapper assembly includes four swappers, each swapper configured to swap substrates between one processing chamber and one load lock along a linear trajectory.