Clustered Microvia PCB Structure for High-Current IC Power Routing
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Solution Overview
Problem
Conventional PCBs face challenges in routing sufficient power to high-performance integrated circuits due to limited power connections and maximum amperage through individual vias, particularly in high-density interconnect microvias for CPUs and GPUs.
Innovation Solution
A clustered microvia structure is introduced, comprising multiple microvias aligned with a single through-hole via, acting as a single conductive element, thereby increasing the power capacity without significantly increasing footprint.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If conventional single via structure is used, then PCB manufacturing is simple, but power routing capacity is insufficient for high-performance ICs
Solution Approach 1:
The patent divides a single via structure into multiple microvia segments arranged in a cluster. Each microvia acts as an individual conductive path, and their collective arrangement provides enhanced power routing capacity while maintaining a compact footprint. The segmentation allows current to flow through multiple parallel paths rather than a single via.
Solution Approach 2:
The patent combines multiple microvias into a unified cluster structure that functions as a single power delivery element. The microvias are grouped together and connected to common pads, merging their individual capacities to achieve higher overall power routing capability. This merging allows the cluster to be treated as one functional unit in the power distribution network.
2Power
If more power connections are added to PCB, then power delivery to ICs increases, but PCB area and complexity increase
Solution Approach 1:
Instead of adding more separate via structures distributed across the PCB, the patent segments the power delivery function into multiple microvias within a single localized cluster. This segmentation concentrates the power delivery capability in one area rather than spreading it out, reducing the overall PCB area required.
Solution Approach 2:
The patent transitions from a single-dimension via structure to a multi-dimensional microvia cluster arrangement. The microvias are positioned in specific spatial relationships (e.g., circular, square, or triangular patterns) around a central axis, utilizing two-dimensional space more efficiently to achieve three-dimensional power delivery capacity enhancement without proportionally increasing PCB footprint.
Data Source
AI summary
According to various embodiments, a printed circuit board includes: a buried via formed through one or more layers of the printed circuit board; a first conductive pad that is formed on a first end of the buried via; a first conductive via that is formed through a first layer of the printed circuit board and is connected to the first conductive pad; and a second conductive via that is formed through the first layer of the printed circuit board and is connected to the first conductive pad.