CMC Microchannel Cooling Layout for Near-Surface Heat Protection
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Solution Overview
Problem
Current methods for forming cooling features in ceramic matrix composite (CMC) components are inadequate for optimizing near-surface cooling, as they lack efficient techniques for creating small, strategically located cooling channels that maximize convection and film cooling effectiveness.
Innovation Solution
A method involving laying up body plies, microchannel plies with voids to form microchannels, and a cover ply to create a CMC component, with machining of film cooling holes to supply cooling fluid from microchannels to the surface, optimizing the size and location of cooling channels for enhanced cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional cooling methods are used in CMC components, then the component structure is simple, but cooling effectiveness is insufficient
Solution Approach 1:
The cooling system is segmented into multiple functional components: microchannels for convection cooling, film cooling holes for film cooling, and a cooling fluid supply conduit. This segmentation allows each component to perform its specific cooling function optimally, resolving the contradiction between cooling effectiveness and structural simplicity.
Solution Approach 2:
Different cooling mechanisms are applied to different locations: microchannels are positioned for convection cooling in specific regions, while film cooling holes are strategically located for film cooling where needed. This local differentiation maximizes cooling effectiveness without requiring complex structures throughout the entire component.
2Reliability
If large cooling channels are used, then the cooling structure is simple to form, but cooling effectiveness is reduced
Solution Approach 1:
The cooling system uses locally optimized channel sizes and positions: microchannels with specific dimensions are placed where convection cooling is most effective, while film cooling holes are positioned and sized for optimal film cooling. This local optimization achieves high cooling effectiveness with reduced overall cooling fluid flow requirements.
Solution Approach 2:
The invention changes the parameters of cooling channels (size, shape, position, distribution) to optimize cooling performance. By carefully controlling these parameters, the system achieves enhanced cooling effectiveness while minimizing the quantity of cooling fluid required.
3Reliability
If microchannels are formed close to the surface, then cooling effectiveness increases, but manufacturing precision requirements increase
Solution Approach 1:
The microchannels and film cooling holes are formed during the molding process itself, before final component assembly. This preliminary formation ensures precise positioning and consistent dimensions without requiring subsequent high-precision machining operations, thereby maintaining manufacturing feasibility while achieving near-surface cooling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables precise formation of small cooling channels near the surface, reducing the cooling fluid flow required while improving cooling effectiveness and extending component life by optimizing convection and film cooling.
Implementation Method 1
microchannels directing a flow of cooling fluid in close proximity to an outer surface of a composite component
Implementation Method 2
machining at least one film cooling hole from an outer surface of the CMC component to supply a film of cooling fluid from the at least one microchannel to the outer surface
Data Source
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AI summary
CMC components (100) having microchannels (116) and methods for forming microchannels (116) in CMC components (100) are provided. For example, a method for forming microchannels (116) in a CMC component (100) comprises laying up a plurality of body plies (120) for forming a body (122) of the CMC component (100)0; laying up a microchannel ply (124) on the plurality of body plies (120) that has at least one void therein for forming at least one microchannel (116); laying up a cover ply (128) on the microchannel ply (124) to define an outer layer (130) of the CMC component (100); and processing the laid up body plies (120), microchannel ply (124), and cover ply (128) to form the CMC component (100). In another embodiment, the method comprises applying an additive matrix (132) to the body plies (120) to define at least one microchannel (116). In still other embodiments, the method comprises machining at least one microchannel (116) in the plurality of body plies (120).