CMM Probe Circuit Board Assembly for Local Signal Processing
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Solution Overview
Problem
Current coordinate measuring machines (CMMs) face challenges in integrating complex circuits due to high-speed data transmission requirements and the need for comprehensive signal processing, which is limited by mechanical stiffness and increased electronics mass, leading to reduced structural integrity and higher assembly costs.
Innovation Solution
A compact CMM probe configuration incorporating a stylus position detection portion, a stylus suspension portion, and a circuit board assembly with a rigid-flex circuit element and three-dimensional carrier frame, enabling local signal processing and motion detection using optical sensing configurations, allowing for efficient data processing and reduced data transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If complex circuits are integrated into the CMM probe to enable comprehensive signal processing and high-speed data transmission, then data processing capability and measurement speed are improved, but the mass of electronics increases and mechanical stiffness decreases
Solution Approach 1:
The patent extracts the complex signal processing and high-speed data transmission circuits from the moving probe assembly and relocates them to the stationary CMM structure. This allows the probe to maintain low mass and high stiffness while the stationary structure provides the computational power and data processing capabilities through integrated circuits and processing units.
2Productivity
If complex circuits are integrated into the CMM probe, then signal processing capability is improved, but structural integrity deteriorates due to reduced mechanical stiffness
Solution Approach 1:
The complex circuits are extracted from the moving probe and placed in the stationary structure, eliminating the compromise between mechanical stiffness and signal processing capability. The probe retains its optimized mechanical design while the stationary structure houses the electronic systems.
Solution Approach 2:
The patent introduces intermediary components including flexible printed circuit boards and magnetic coupling mechanisms that transmit signals and power between the moving probe and stationary structure without compromising the probe's mechanical integrity. These intermediaries enable complex signal processing while maintaining structural strength.
3Measurement precision
If complex circuits are integrated into the CMM probe, then measurement accuracy is improved through comprehensive signal processing, but assembly cost increases
Solution Approach 1:
By extracting the complex circuits from the probe, the patent simplifies probe manufacturing and assembly while concentrating the complex electronic integration in the stationary structure where assembly facilities and expertise are more readily available, reducing overall assembly costs.
Solution Approach 2:
The use of standardized intermediary interfaces and modular connection systems between the probe and stationary structure simplifies assembly procedures and enables easier maintenance and replacement, reducing assembly costs while maintaining measurement accuracy through comprehensive signal processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the ability to process data locally within the CMM, reducing transmission demands and maintaining mechanical stiffness while integrating complex circuits, thus enabling high-speed operations with improved accuracy and cost-effectiveness.
Implementation Method 1
an optical sensing configuration mounted in a fixed relationship to the alignment frame
Data Source
Figure 1
Figure 2
Figure 3A
AI summary
A compact coordinate measuring machine (CMM) probe configuration is provided for integrating complex circuits into a CMM probe. The CMM probe configuration includes a stylus position detection portion, a stylus suspension portion and a circuit board assembly. The stylus position detection portion includes an alignment frame and an optical sensing configuration. The circuit board assembly includes a rigid flex circuit element and a three dimensional carrier frame. The rigid flex circuit element includes a set of board portions joined by a set of flexible bend portions. The rigid flex circuit element is folded at the bend portions to locate some of the board portions to be proximate to and/or joined to corresponding support surfaces on the carrier frame. The circuit board assembly at least partially surrounds a majority of the stylus position detection portion and is joined thereto with the carrier frame fixed relative to the alignment frame.