Temperature Sensor Carrier for CMM Thermal Correction
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Solution Overview
Problem
Coordinate measuring machines face challenges in maintaining measurement accuracy due to external environmental influences, particularly temperature fluctuations, which cause thermal distortions and inaccuracies, and existing temperature sensor mounting methods are cumbersome, difficult to position accurately, and prone to detachment.
Innovation Solution
The integration of temperature sensor units with a carrier element, a temperature sensor, and a heating element, allowing for stable and space-saving arrangement, enabling easy defect detection and correct mounting verification by activating and deactivating the heating elements and analyzing temperature data, along with the use of light-emitting elements for optical assignment and simplified handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If temperature sensors are adhesively bonded at different positions on the measurement device, then temperature data can be captured for correction, but the sensors are difficult to position accurately and may become detached
Solution Approach 1:
The measurement device structure is segmented into modular components (measurement head, guide structure, bridge, carriage) with temperature sensors strategically positioned at each segment. This segmentation allows independent mounting and replacement of sensors while maintaining overall system thermal monitoring capability.
Solution Approach 2:
Temperature sensors are pre-positioned and adhesively bonded to their mounting locations on the measurement device structure before actual measurement operations begin. This preliminary positioning ensures accurate thermal data collection from critical structural points, enabling proactive thermal compensation throughout the measurement process.
2Measurement precision
If multiple temperature sensors are used to capture temperature data, then thermal distortions can be corrected more accurately, but the sensors are difficult to assign and handle
Solution Approach 1:
A central control unit serves as an intermediary that receives temperature data from multiple sensors, automatically identifies each sensor's location based on predefined assignments, and processes the thermal compensation calculations. This intermediary eliminates the need for manual sensor tracking and simplifies the complex task of managing multiple temperature measurement points.
3Manufacturing precision
If temperature sensors are fixed at significant locations on the measurement device, then thermal deformation prediction is improved, but the positioning and assignment of sensors becomes complex
Solution Approach 1:
Temperature sensors are selectively positioned at specific critical locations on the measurement device structure (measurement head, guide structure, bridge, carriage) where thermal deformations have the greatest impact on measurement accuracy. Each sensor monitors the local thermal state of its specific mounting location, enabling targeted thermal compensation without requiring sensors throughout the entire device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the accuracy of temperature correction by ensuring stable sensor positioning, simplifying sensor assignment, and reducing errors caused by detachment, thereby improving the overall measurement precision of coordinate measuring machines.
Implementation Method 1
each of the temperature sensor units includes a carrier element, a temperature sensor connected to the carrier element, and a heating element connected to the carrier element
Data Source
AI summary
A measurement device includes a measurement head configured to capture dimensional measurement data of a measurement object. A guide structure is configured to move and guide at least one of the measurement head and the measurement object in a measurement volume of the measurement device. A measurement unit is configured to capture positional data of the guide structure based on which a pose of the measurement head can be calculated. Multiple temperature sensor units are configured to capture temperature data about the measurement volume. Each temperature sensor unit includes a carrier element, a temperature sensor connected to the carrier element, and a heating element connected to the carrier element. A control system is configured to process the dimensional measurement data and the positional data and, based on the temperature data, correct at least one of the dimensional measurement data and the positional data.