CMOS Control Element Array for MEMS Density
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional MEMS device arrays face limitations due to manufacturing design rules that require specific spacing between CMOS control elements, making it challenging to pack densely and achieve optimal performance, especially in applications like fingerprint sensing where ultrasonic transducers need to be arranged in a two-dimensional array without a one-to-one correspondence with CMOS control elements.
Innovation Solution
The arrangement of CMOS control elements in a two-dimensional array is optimized by grouping semiconductor devices of the same class together, allowing for asymmetric layouts and shared boundaries between blocks, which reduces the impact of spacing constraints and enables more efficient packing and performance enhancement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If CMOS control elements are arranged with required spacing according to manufacturing design rules, then manufacturing reliability is improved, but device density and array compactness deteriorate
Solution Approach 1:
The patent merges multiple CMOS control elements into shared blocks where a single block controls multiple MEMS devices. This consolidation reduces the total number of control elements required, thereby increasing device density while maintaining manufacturing reliability through proper spacing within each shared block.
Solution Approach 2:
Each CMOS control element is designed to universally control multiple MEMS devices within its shared block, rather than having a one-to-one correspondence. This multi-functionality allows the same control element to manage different MEMS devices, reducing overall component count and improving density.
2Quantity of substance
If CMOS control elements are packed densely to improve device density, then array compactness is improved, but manufacturing precision and reliability deteriorate due to spacing constraints
Solution Approach 1:
The array is segmented into multiple shared blocks, each containing a manageable number of MEMS devices controlled by dedicated CMOS elements. This segmentation allows precise spacing control within each block while achieving high overall density through the distributed block structure.
Solution Approach 2:
The patent transitions from a one-to-one control mapping to a many-to-one mapping arrangement, organizing control elements in a two-dimensional shared block structure. This dimensional reorganization allows denser packing by utilizing spatial efficiency in the control element layout rather than requiring proportional spacing for each individual device.
3Measurement precision
If a one-to-one correspondence between ultrasonic transducers and CMOS control elements is used, then control precision is improved, but device complexity and array size increase
Solution Approach 1:
Multiple MEMS devices are merged under the control of a single CMOS control element within shared blocks. This merging maintains sufficient control precision for each device while reducing the total number of control elements, thereby simplifying the overall array structure and reducing complexity.
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
An electronic device includes a plurality of CMOS control elements arranged in a two-dimensional array, where each CMOS control element of the plurality of CMOS control elements includes two semiconductor devices. The plurality of CMOS control elements include a first subset of CMOS control elements, each CMOS control element of the first subset of CMOS control elements including a semiconductor device of a first class and a semiconductor device of a second class, and a second subset of CMOS control elements, each CMOS control element of the second subset of CMOS control elements including a semiconductor device of the first class and a semiconductor device of a third class. The plurality of CMOS control elements are arranged in the two-dimensional array such that CMOS semiconductor devices of a class are only adjacent to other CMOS semiconductor devices of the same class.