CMOS Driver Circuit Bias Decoupling for High-Voltage Operation

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

CMOS integrated circuits face challenges in handling high power supply voltages due to overstress across transistor terminals, leading to potential channel breakdown and gate oxide degradation, while existing solutions like cascoded pad drivers suffer from high coupling issues that slow down driving capability and increase static current.

Innovation Solution

The implementation of a CMOS circuit with complementary driver circuits that switch in opposite directions to decouple bias voltages, using additional Miller capacitors to compensate for reduced parasitic capacitance, thereby minimizing high coupling without increasing static current.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a high power supply voltage is directly applied to low voltage MOS transistors, then the circuit can operate at higher voltage levels, but this causes overstress across transistor terminals leading to channel breakdown and gate oxide degradation

Engineering Contradiction:
Improvepower supply voltageVSAvoidtransistor terminal stress
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The driver circuit is divided into multiple transistor stages (first driver circuit with transistors P1, N1 and second driver circuit with transistors P2, N2) where each stage handles a portion of the voltage swing. This segmentation allows the circuit to achieve high voltage operation while individual transistors experience reduced stress.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Bias voltages (REFp and REFn) are introduced as intermediary voltage levels that mediate between the high supply voltage and the transistor terminal stress limits. These bias voltages control the gate terminals to ensure that voltage differences across any single transistor never exceed the maximum stress voltage Vx, even when operating at high supply voltages.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Power

If cascoded pad driver transistor sizes are increased to drive high output loads, then the driving capability is improved, but this increases parasitic capacitance which causes high coupling and slows down the circuit

Engineering Contradiction:
Improvedriving capabilityVSAvoidcoupling effect
Core Design Contradiction:
PowerVSSpeed

Solution Approach 1:

The second driver circuit is designed to switch in the opposite direction to the first driver circuit. When the first driver circuit switches cause coupling on bias voltages, the second driver circuit switches in reverse to decouple the bias voltages. This inverse switching action compensates for the harmful coupling effects and maintains fast switching performance.

Inventive Principle:
Principle #13The other way round (Inversion)

3Power

If transistor sizes are increased to reduce coupling effects, then the driving capability is improved, but this increases static current consumption

Engineering Contradiction:
Improvedriving capabilityVSAvoidstatic current
Core Design Contradiction:
PowerVSUse of energy by moving object

Solution Approach 1:

The circuit employs dynamic switching where the second driver circuit adapts its switching behavior based on the state of the first driver circuit. This dynamic operation allows the circuit to maintain driving capability while minimizing static current consumption by ensuring that not all transistors are in high-current states simultaneously.

Inventive Principle:
Principle #15Dynamics

Data Source

PatentEP1999849B1Electronic device and integrated circuit
Publication Date: 2011.05.25 ELIPOSKI REMOTE LTD LLC
  • EP1999849B1 patent drawingFigure 1a~1b
  • EP1999849B1 patent drawingFigure 1c~1d
  • EP1999849B1 patent drawingFigure 1e~1f

AI summary

An electronic device with a CMOS circuit (CC) comprises a first driver circuit (10) having a first and second PMOS transistor (Pl, P2) and a first and second NMOS transistor (Nl, N2). The electronic device furthermore comprise a second driver circuit (20) with a third and fourth PMOS transistor (P3, P4) and a third and fourth NMOS transistor (N3, N4). The second driver circuit (20) is complementary to the first driver circuit (10) and switches in the opposite direction to the first driver circuit (10). A gate of the second and fourth PMOS transistor (P2, P4) is coupled to a first bias voltage (REPp) and a gate of the second and fourth NMOS transistor (N2, N4) is coupled to a second bias voltage (REFn). A first capacitance (C3) is coupled between the gate and the drain of the fourth PMOS transistor (P4) and a second capacitance (C4) is coupled between the gate and the drain source of the fourth NMOS transistor (N4).