CMOS Control Element Grouping for Dense MEMS Arrays
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Solution Overview
Problem
Conventional MEMS device arrays face limitations due to manufacturing design rules that require specific spacing between CMOS control elements, making it challenging to pack densely and achieve optimal performance, especially in applications like fingerprint sensing where ultrasonic transducers need to be arranged in a two-dimensional array without a one-to-one correspondence with CMOS control elements.
Innovation Solution
The arrangement of CMOS control elements in a two-dimensional array is optimized by grouping semiconductor devices of the same class together, allowing for asymmetric layouts and alternating patterns that reduce the impact of spacing rules, enabling a more compact and efficient layout of MEMS devices such as PMUTs while adhering to manufacturing constraints.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If CMOS control elements are arranged with required spacing according to manufacturing design rules, then manufacturing precision is maintained, but array density decreases
Solution Approach 1:
The patent transitions from conventional one-to-one correspondence between MEMS elements and control electronics to a many-to-one mapping scheme. Multiple MEMS elements (e.g., 2×2=4 elements) share a single CMOS control element, effectively utilizing the two-dimensional array space more efficiently while maintaining required spacing between control elements for manufacturing compliance.
Solution Approach 2:
The patent combines multiple MEMS control elements under a single CMOS control element, merging the control functions. This allows the physical spacing requirements between control elements to be satisfied while still controlling a larger number of MEMS elements, thereby increasing array density without compromising manufacturing precision.
2Quantity of substance
If MEMS devices are packed densely in two-dimensional arrays, then array density improves, but manufacturing complexity increases due to spacing constraints
Solution Approach 1:
The patent segments the control electronics into modular CMOS control elements that can be systematically repeated across the array. Each control element follows the same design template, simplifying the layout process despite high density. The segmentation of MEMS elements into groups controlled by single CMOS elements also regularizes the pattern, reducing layout complexity.
Solution Approach 2:
The patent creates universal CMOS control elements that can control multiple MEMS elements through shared control lines and circuits. This multi-functionality reduces the total number of control elements needed, simplifying the overall device layout while maintaining high MEMS array density.
3Measurement precision
If one-to-one correspondence is maintained between MEMS elements and control electronics, then control precision is optimized, but device area increases
Solution Approach 1:
The patent merges multiple MEMS element control functions into single CMOS control elements, reducing the total control electronics area. The shared control architecture maintains sufficient control precision through multiplexed control lines and switched capacitor arrays that can individually address each MEMS element within the group.
Solution Approach 2:
The patent introduces a many-to-one mapping relationship that changes the dimensional correspondence from 1:1 to N:1 (where N>1). This allows the same control precision to be achieved with reduced area by utilizing spatial multiplexing and time-division multiplexing of control signals across multiple MEMS elements.
Data Source
AI summary
An electronic device includes a plurality of CMOS control elements arranged in a two-dimensional array and a plurality of MEMS devices. Each CMOS control element of the plurality of CMOS control elements includes at least one of a low voltage semiconductor device, a high voltage PMOS semiconductor device, and a high voltage NMOS semiconductor device. Each MEMS device of the plurality of MEMS devices is associated with a CMOS control element of the plurality of CMOS control elements. The plurality of CMOS control elements are arranged in the two-dimensional array such that low voltage semiconductor devices are only adjacent to other low voltage semiconductor devices, high voltage PMOS semiconductor devices are only adjacent to other high voltage PMOS semiconductor devices, and high voltage NMOS semiconductor devices are only adjacent to other high voltage NMOS semiconductor devices.