CMOS Image Sensor Microlens Alignment via Dedicated Mark

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Solution Overview

Problem

Existing CMOS image sensors face light loss and image quality deterioration due to misalignment and overlay variations in metal and via formation processes, which affect the alignment of microlenses and lead to light scattering and reflection.

Innovation Solution

The solution involves aligning microlenses directly above the active area of the pixel region, using an alignment key specific to the active area rather than the metal layers, to manage overlay variations and enhance optical efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If microlens alignment uses top metal layer as reference, then metal layer formation is simplified, but overlay variation increases causing light scattering and reflection

Engineering Contradiction:
Improvemetal layer formation processVSAvoidmicrolens alignment precision
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

An alignment mark structure is introduced as an intermediary element between the metal layers and microlens formation processes. This alignment mark serves as a dedicated reference feature that mediates the alignment process, allowing microlenses to be precisely positioned relative to the pixel area without being directly dependent on metal layer alignment. The alignment mark structure includes features that can be clearly identified during photolithography alignment, thus improving manufacturing precision while maintaining ease of manufacture.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Device complexity

If metal and via formation processes are performed without considering light path, then device complexity is reduced, but light loss increases due to misalignment and overlay variation

Engineering Contradiction:
Improveformation process complexityVSAvoidlight loss
Core Design Contradiction:
Device complexityVSLoss of energy

Solution Approach 1:

The alignment mark structure is formed in advance during the metal layer formation process, specifically as part of the upper metal layer pattern. This preliminary action ensures that the alignment reference is already in place before microlens formation begins. By performing this alignment preparation in advance, the system maintains simple formation processes while enabling precise microlens alignment that prevents light loss from misalignment.

Inventive Principle:
Principle #10Preliminary action

3Ease of manufacture

If alignment key is not provided for active area, then manufacturing process is simplified, but color difference dispersion increases due to misalignment

Engineering Contradiction:
Improvemanufacturing process simplicityVSAvoidmicrolens alignment with active area
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The alignment mark structure merges multiple functions into a single integrated feature. It serves both as part of the metal layer structure (specifically the upper metal layer pattern) and as the alignment reference for microlens formation. This merging eliminates the need for separate alignment keys while maintaining precise alignment capability, thus preserving manufacturing simplicity while improving alignment precision and reducing color difference dispersion.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS7786423B2Image sensor and method for manufacturing the same
Publication Date: 2010.08.31 III HOLDINGS 4 LLC
  • US7786423B2 patent drawing
  • US7786423B2 patent drawing
  • US7786423B2 patent drawing

AI summary

An image sensor is disclosed that can provide a microlens aligned directly above an active area of a substrate. The image sensor can include a substrate having a pixel area. An active region can be formed on the pixel area and can include photodiodes. Metal lines and an interlayer dielectric can be provided on the pixel area of the substrate. A microlens can be formed above the metal lines and interlayer dielectric to be directly aligned with the active area of the pixel area. To achieve such an alignment, an alignment key of the microlens can be aligned with an alignment key of the active region. In one embodiment, the microlens can avoid being formed right above the metal lines.