CMOS Image Sensor Package Width Reduction via Bottom-Mounted Components
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The width of the lens holder in CMOS sensor package modules for portable electronic devices cannot be decreased due to the presence of electronic components on the PCB, limiting their integration in smaller devices.
Innovation Solution
The image-capturing module design includes a circuit substrate with electronic components on the bottom surface and a package structure on top, allowing the lens holder to be positioned on the top surface without increasing the horizontal width, by using a through opening and a package structure that surrounds the image-sensing chip and includes a heat-dissipating structure for enhanced rigidity and protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If electronic components are disposed on the PCB of the CMOS sensor package module, then the module can maintain its functionality, but the width of the lens holder cannot be decreased
Solution Approach 1:
The patent applies dimensionality change by moving electronic components from the top surface to the bottom surface of the PCB, utilizing the z-dimension (vertical space) to resolve the horizontal width constraint. This allows the lens holder width to be reduced while maintaining all necessary electronic components in the system.
Solution Approach 2:
The patent inverts the conventional arrangement by placing electronic components on the bottom surface of the PCB instead of the top surface. This inversion enables the lens holder to be positioned more centrally on the top surface, reducing its horizontal width while maintaining functionality.
2Strength
If the package structure covers the electronic components on the bottom surface, then the structural strength is increased, but the accessibility of electronic components may be reduced
Solution Approach 1:
The package structure is segmented with openings that selectively expose specific electronic components while covering others. This segmentation allows the structure to provide overall protection and strength while maintaining accessibility to components that require interaction, such as connection terminals.
Solution Approach 2:
The package structure exhibits local quality by having different regions with different levels of coverage - some areas are fully covered for protection, while other areas have openings for accessibility. This localized differentiation allows simultaneous achievement of structural strength and component accessibility where needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces the horizontal width of the lens holder, increasing the structural strength and rigidity of the circuit substrate while maintaining the functionality of the image-sensing chip and lens assembly, enabling more compact integration in portable devices.
Implementation Method 1
a heat-dissipating structure disposed on the flattening surface of the package structure for contacting the bottom surface of the at least one conductive body
Data Source
AI summary
The present invention provides a portable electronic device, and an image-capturing module thereof and a carrier assembly thereof. The image-capturing module includes a circuit substrate, an image-sensing chip, at least one electronic component, a package structure, and a lens assembly. The circuit substrate has a top surface and a bottom surface. The image-sensing chip is electrically connected to the circuit substrate, and the image-sensing chip has an image-sensing area. The at least one electronic component is disposed on the bottom surface of the circuit substrate and electrically connected to the circuit substrate. The package structure is disposed on the bottom surface of the circuit substrate to cover the at least one electronic component. The lens assembly includes a holder structure disposed on the top surface of the circuit substrate and a lens structure held by the holder structure and corresponding to the image-sensing area.