CMOS Sensor Integration in Disposable Cavity Exploration Heads
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Solution Overview
Problem
Existing cavity exploration devices are costly due to the need for optical fibers and complex mechanical connections, which also degrade image quality and require disinfection between uses, making them unsuitable for disposable applications and limiting their use in small cavities.
Innovation Solution
A manufacturing process for a cavity exploration device head with integrated circuit supports and micro-cables, where the micro-cables are soldered, glued, and molded onto conducting pads, eliminating the need for bulky connectors and optical fibers, allowing for a compact CMOS image sensor and light-emitting diodes, enabling direct image capture and illumination within small cavities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If optical fibers are used to transmit images from the cavity, then image transmission is achieved, but the device cost increases and requires disinfection between uses
Solution Approach 1:
The patent extracts the image sensor from the external module and integrates it directly into the exploration head that enters the cavity. This eliminates the need for optical fibers to transmit images from the cavity, as the sensor itself is positioned inside to capture images directly. The extraction of the sensor from the external module resolves the contradiction by removing the optical fiber transmission path while maintaining image capture capability.
Solution Approach 2:
By integrating the image sensor into the disposable exploration head, the patent enables the entire head to be discarded after a single use. This eliminates the need for expensive disinfection procedures and repeated cleaning of optical fibers between uses. The disposable nature of the integrated sensor head resolves the contradiction by making the system cheaper for single-use applications while maintaining reliable image transmission during each use.
2Strength
If mechanical connectors are used to connect the image sensor, then connection strength is achieved, but the head size increases
Solution Approach 1:
The patent replaces mechanical connectors with direct soldering connections between the image sensor and the circuit board. Instead of using bulky male and female mechanical connectors, the electrical and mechanical connection is achieved through solder joints, which occupy minimal space. This substitution resolves the contradiction by maintaining connection strength through proper soldering while dramatically reducing the head size required for the exploration device.
3Volume of moving object
If a flexible support is used for the CMOS sensor, then miniaturization is achieved, but manufacturing cost increases
Solution Approach 1:
The patent merges the CMOS sensor, its flexible support, and the circuit board into a single integrated assembly. The flexible support is used to mount the sensor directly onto the circuit board, eliminating the need for separate mechanical mounting structures. This merging resolves the contradiction by achieving miniaturization through integration while controlling manufacturing costs through simplified assembly processes.
4Loss of information
If optical signals are transmitted through optical fibers, then image data is transmitted, but image quality degrades
Solution Approach 1:
The patent extracts the image sensor from the external module and positions it directly inside the exploration head within the cavity. This extraction eliminates the optical fiber transmission path that causes image quality degradation. By capturing images directly at the source and transmitting electrical signals rather than optical signals through fibers, the system maintains superior image quality while still achieving effective image data transmission.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces costs, allows for disposable exploration heads, improves image quality, and facilitates the exploration of small cavities by eliminating the need for optical fibers and complex connectors, while enabling simultaneous imaging of multiple cavity regions.
Implementation Method 1
soldering the micro-cable to the associated first and second conducting pads
Implementation Method 2
gluing the micro-cable with glue to the associated first and second conducting pads
Implementation Method 3
molding the micro-cable in first and second layers of resin onto the respective first and second conducting pads
Data Source
AI summary
A head of a cavity exploration device, with an integrated circuit support which has first and second surfaces and a plurality of through-holes associated with corresponding first and second conducting pads positioned on the respective first and second surfaces of the integrated circuit support, a respective conducting micro-cable is placed in the through-hole, with this micro-cable having a portion which is uninsulated for a length greater than or equal to the thickness of the support. The micro-cable is soldered to the associated first and second conducting pads. Next the micro-cable is glued to the first and second associated conducting pads. The micro-cable is molded in first and second resin layers onto the respective first and second conducting pads, with the resin layers covering the uninsulated portion of the micro-cable.