CMOS Image Sensor I/O Reduction via Dual-Pad Interconnects
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Solution Overview
Problem
Endoscopic devices face challenges in minimizing the size of image sensors while maintaining image quality, as traditional rod-lens endoscopes are expensive and prone to damage, and CMOS sensors require significant space for bond pads and power supplies, leading to increased costs and complexity.
Innovation Solution
The use of minimal pad interconnects, internal DC-DC converters for power supply, and dual-purpose pads for input/output functionality, along with on-chip voltage generation and digital encoding of data, reduces the sensor size and conductor count, enabling cost-effective and versatile endoscope systems with high-definition imaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional rod-lens endoscopes are used, then image quality can be maintained, but the device becomes expensive and prone to damage
Solution Approach 1:
The patent employs disposable CMOS image sensors that can be discarded after a single use, eliminating the need for expensive, fragile rod-lens systems. These sensors are designed to be cost-effective single-use components that capture high-quality images without requiring repair or sterilization, directly addressing the contradiction between reliability and manufacturing cost.
Solution Approach 2:
The invention replaces the mechanical rod-lens optical system with electronic CMOS image sensors and associated circuitry. This substitution eliminates the fragile mechanical components while maintaining imaging capability, reducing both cost and susceptibility to damage while enabling digital processing and transmission of images.
2Ease of manufacture
If CMOS sensors are used to reduce cost, then manufacturing cost decreases, but the sensor area increases due to bond pads and power supplies
Solution Approach 1:
The patent merges the power supply circuitry and signal processing functions directly onto the CMOS sensor chip itself. By integrating DC-DC converters, voltage regulators, and data processing circuits on-chip, the design eliminates the need for separate power supply components and extensive bond pad structures, thereby reducing the overall sensor area while maintaining cost-effectiveness.
Solution Approach 2:
The CMOS sensor is designed with multi-functional circuitry that performs both imaging and power management functions. The sensor chip includes integrated voltage generation, signal processing, and data encoding capabilities, allowing a single component to fulfill multiple roles that would traditionally require separate elements, thus reducing total area.
3Area of moving object
If sensor size is minimized, then device compactness improves, but the number of bond pads and power supplies must be reduced
Solution Approach 1:
The patent extracts and eliminates unnecessary bond pads and external power supply connections by integrating all required functions onto the sensor chip. Only essential I/O connections remain, minimizing the conductor count and bond pad requirements while maintaining full functionality through on-chip integration of power management and signal processing.
Solution Approach 2:
The design nests multiple functional circuits within the CMOS sensor chip structure itself. Power management circuits, voltage regulators, and data processing logic are embedded within or adjacent to the pixel array, creating a compact integrated structure that minimizes external connections and bond pad requirements while maximizing functional density.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in cost-effective, compact, and robust endoscope systems with high-definition imaging capabilities, reducing the need for repair and sterilization, and enhancing manufacturability by minimizing the number of bond pads and power supplies, while maintaining image quality and sensitivity.
Implementation Method 1
internal DC-DC converters for power supply, and dual-purpose pads for input/output functionality, along with on-chip voltage generation
Data Source
AI summary
The disclosure extends to systems and methods for reducing the area of an image sensor by employing bi-directional pads used for both image data issuance and configuration command reception and internal supply voltage generation, for reducing the number of conductors in an endoscope system.