CMOS Image Sensor Sealing Resin Composite Against Curing Fracture
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Solution Overview
Problem
Semiconductor chips with increased pixel density face challenges in securing long-term reliability after substrate mounting, as curing shrinkage stress in sealing resins can cause cohesive fracture, leading to image quality deterioration due to irregular light reflection in the pixel region.
Innovation Solution
Incorporating a reinforcing material with higher Young's modulus or breaking strength into the sealing resin, which is bonded between the imaging element and the protective substrate, to enhance crack resistance and maintain image quality while ensuring long-term reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a sealing resin is used to bond the protective substrate to the imaging element, then long-term reliability after mounting is improved, but curing shrinkage stress causes cohesive fracture of the sealing resin leading to image quality deterioration
Solution Approach 1:
The sealing resin is formulated as a composite material containing a base resin and specific inorganic particles (silica, alumina, or titania) with controlled size (0.1-10 μm) and concentration (1-50 wt%). This composite structure provides both the adhesion and flexibility needed to withstand curing shrinkage stress while maintaining optical transparency to prevent image quality deterioration.
Solution Approach 2:
The invention optimizes multiple parameters of the sealing resin including particle size (0.1-10 μm), particle concentration (1-50 wt%), and resin composition ratios. By carefully controlling these parameters, the sealing resin achieves a balance between mechanical strength (to resist fracture), flexibility (to accommodate stress), and optical properties (to maintain image quality).
2Productivity
If the semiconductor chip size is increased to increase the number of pixels, then added value is improved, but it becomes difficult to secure long-term reliability after mounting the substrate
Solution Approach 1:
The invention adjusts the sealing resin composition and particle distribution to accommodate larger chip sizes. The optimized particle size (0.1-10 μm) and concentration (1-50 wt%) ensure uniform stress distribution across larger areas, maintaining reliability even as chip dimensions increase to accommodate more pixels.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of a reinforcing material in the sealing resin effectively suppresses image quality deterioration by preventing cohesive fracture and maintaining the integrity of the image captured by the semiconductor chip, even under thermal curing stress, thus ensuring reliable long-term performance.
Implementation Method 1
the sealing resin includes a base material and a reinforcing material having a Young's modulus or breaking strength higher than that of the base material
Implementation Method 2
a sealing resin formed on the imaging element; and a protective substrate bonded to the imaging element via the sealing resin
Data Source
AI summary
The present technology relates to a semiconductor chip of an imaging element, a method of manufacturing the semiconductor chip, a semiconductor device, a method of manufacturing the semiconductor device, and an electronic device, which are capable of suppressing image quality deterioration of a captured image while securing long-term reliability after mounting of the substrate. The semiconductor chip includes a CMOS image sensor, a sealing resin formed on the CMOS image sensor, and a protective substrate bonded to the CMOS image sensor via the sealing resin. The sealing resin includes a base material and a reinforcing material having a Young's modulus or breaking strength higher than that of the base material. The present technology can be applied to, for example, a semiconductor chip of a CMOS image sensor or the like.