Integrated CMOS TIA-DSP Receiver for High-Speed Optical Modules

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Current optical modules with stand-alone TIAs are costly and power-consuming, and integrating CMOS TIAs with DSPs results in weak performance, preventing their use in high-end, ultra-high-speed optical modules.

Innovation Solution

Integrating a CMOS TIA circuit with a DSP circuit on a single chip, eliminating interconnections and allowing the DSP to control and optimize the TIA's performance, including power supply and gain allocation, to enhance system performance and enable high-speed applications.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If stand-alone bipolar TIA is used in optical modules, then performance is maintained, but cost and power consumption increase

Engineering Contradiction:

ImproveperformanceVSAvoidpower consumption

Core Design Contradiction:

ReliabilityVSUse of energy by moving object

Solution Approach 1:

The patent combines the TIA and DSP circuits into a single integrated chip, eliminating the need for separate bipolar TIA components. This integration maintains the performance benefits of bipolar TIA while reducing overall power consumption and cost by using CMOS technology for both circuits.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent replaces the traditional bipolar TIA technology with CMOS TIA technology, substituting one electronic system with another that offers lower power consumption and cost while maintaining or improving performance through integration with DSP.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Use of energy by moving object

If CMOS TIA is integrated with DSP, then cost and power consumption are reduced, but performance becomes weak

Engineering Contradiction:

Improvepower consumptionVSAvoidperformance

Core Design Contradiction:

Use of energy by moving objectVSReliability

Solution Approach 1:

The patent integrates CMOS TIA and DSP circuits on the same chip, allowing them to work together as a unified system. This integration enables the CMOS TIA to achieve performance comparable to or exceeding traditional bipolar TIA by leveraging the combined processing power of the integrated DSP.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent employs dynamic equalization and signal processing techniques within the integrated DSP to compensate for any performance limitations of the CMOS TIA, allowing the system to adapt and maintain high performance across varying operating conditions.

Inventive Principle:

Principle #15Dynamics

3Reliability

If stand-alone TIA and DSP are used, then performance is maintained, but system footprint increases

Engineering Contradiction:

ImproveperformanceVSAvoidsystem footprint

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The patent merges the TIA and DSP circuits into a single integrated chip, dramatically reducing the system footprint by eliminating the need for separate components and interconnections while maintaining or improving performance through their integrated design.

Inventive Principle:

Principle #5Merging (Combining)

4Adaptability or versatility

If stand-alone TIA and DSP are used with interconnections, then functionality is maintained, but crosstalk and reflections occur

Engineering Contradiction:

ImprovefunctionalityVSAvoidcrosstalk and reflections

Core Design Contradiction:

Adaptability or versatilityVSObject-generated harmful factors

Solution Approach 1:

The patent integrates the TIA and DSP circuits on the same chip, eliminating the physical interconnections between separate components. This integration removes the sources of crosstalk and reflections that occur in stand-alone configurations while maintaining full functionality through direct on-chip signal paths.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS12401335B2Integrated transimpedance amplifier with a digital signal processor for high-speed optical receivers

Publication Date: 2025.08.26 AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE LTD

AI summary

An optical module includes an optical receiver with a complementary metal-oxide semiconductor (CMOS) transimpedance amplifier (TIA) and a digital signal processing (DSP) circuit. The DSP circuit is integrated with the CMOS TIA and facilitates adaptability of the CMOS TIA, and the CMOS TIA can adapt by using information provided by the DSP circuit.