CMOS Wireless Power Receiver With On-Chip Inductor

The patent merges the receiver coil with the CMOS chip by fabricating the coil directly on the chip substrate using standard CMOS fabrication processes. This integration eliminates the need for separate external receiver coils, reducing overall system size and weight while maintaining wireless power transfer functionality. The coil is formed using metal interconnect layers already present in CMOS technology, creating a compact unified structure.

The receiver coil is nested within the CMOS chip structure itself, with the coil traces formed using the chip's existing metal layers. This nesting approach allows the coil to be embedded within the chip footprint rather than requiring external space, effectively reducing the overall system volume and making the receiver suitable for implantable applications where space is critical.

By integrating the receiver coil directly with the CMOS rectifier circuitry on the same chip, the patent eliminates intermediate connection interfaces and reduces parasitic losses. The direct integration allows for optimized coupling between the coil and rectifier, improving overall power transfer efficiency compared to externally connected systems.

The patent optimizes the coil geometry and electrical parameters (inductance, quality factor) specifically for integration with CMOS circuits. By tailoring the coil design parameters to match the operating conditions of the integrated rectifier, the system achieves higher efficiency in converting received RF energy to usable DC power.

The patent leverages the multi-functionality of standard CMOS fabrication processes to create the receiver coil using existing metal interconnect layers. This approach uses the same manufacturing steps already required for CMOS circuit fabrication, avoiding the need for additional specialized coil fabrication processes and reducing overall manufacturing complexity despite the integrated design.

The CMOS fabrication process itself provides the necessary structures for the coil, using the chip's own metal layers and patterning capabilities. The system essentially manufactures its own coil during standard chip production, eliminating the need for separate coil fabrication and assembly processes.