CMP Brush Cleaning with Spray Nozzle and Scrubbing Plate

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Solution Overview

Problem

Existing brush cleaning methods for semiconductor wafers after chemical mechanical polishing (CMP) fail to effectively remove contaminants adsorbed onto the brush surface, leading to potential reverse contamination of the wafer during subsequent processes.

Innovation Solution

A brush cleaning equipment with a rotating unit, a plate for mechanical scrubbing, and a cleaning material supply unit that includes a main body, nozzle, and pressurized gas to spray cleaning materials onto the brush surface, ensuring efficient removal of contaminants.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If scrubber cleaning is performed by rotating a brush to clean the wafer surface, then the wafer can be cleaned of contaminants, but contaminants adsorbed onto the brush surface may be re-deposited onto the wafer causing reverse contamination

Engineering Contradiction:

Improvecleaning effectivenessVSAvoidreverse contamination

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The brush cleaning apparatus performs preliminary cleaning action by spraying cleaning material onto the brush surface before the brush is used to clean the wafer. This preliminary cleaning of the brush prevents contaminants from being re-deposited onto the wafer during subsequent cleaning operations.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

A cleaning material supply unit acts as an intermediary between the brush and the contamination source. This unit supplies cleaning material to the brush surface, mediating the interaction between the brush and contaminants to prevent reverse contamination of the wafer.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Productivity

If the brush is used repeatedly for cleaning wafers, then productivity is maintained, but contaminants accumulate on the brush surface increasing reverse contamination risk

Engineering Contradiction:

Improvecontinuous cleaning capabilityVSAvoidcontaminant accumulation on brush

Core Design Contradiction:

ProductivityVSObject-generated harmful factors

Solution Approach 1:

The brush cleaning apparatus enables continuous operation by maintaining brush cleanliness throughout repeated use. The cleaning material supply unit continuously supplies cleaning material to the brush surface, ensuring the brush remains effective for wafer cleaning without accumulation of contaminants.

Inventive Principle:

Principle #20Continuity of useful action

Solution Approach 2:

The brush cleaning apparatus allows the brush to clean itself during operation. The cleaning material supply unit delivers cleaning material directly to the brush surface, enabling the brush to maintain its own cleanliness and continue effective wafer cleaning without manual intervention.

Inventive Principle:

Principle #25Self-service

3Reliability

If a plate is used to rub against the brush surface for cleaning, then mechanical scrubbing is achieved, but additional components are required increasing device complexity

Engineering Contradiction:

Improvebrush surface cleaningVSAvoidnumber of components

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The brush cleaning apparatus merges the cleaning function into an integrated system where the cleaning material supply unit and plate work together as a unified assembly. This combination achieves effective brush cleaning while managing device complexity through functional integration.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The equipment effectively removes contaminants from the brush surface, preventing reverse contamination of semiconductor wafers and maintaining cleaning efficiency over multiple cycles.

Implementation Method 1

a pressurizing unit configured to pressurize the cleaning material carried into the container with pressurized gas

Methodology Applied

Scientific EffectPressure gradient: Pressure Gradient

Implementation Method 2

a nozzle configured to receive the cleaning material from the container and spray the cleaning material onto the surface of the brush

Methodology Applied

Scientific EffectFluid spray: Fluid Spray

Implementation Method 3

a plate configured to rub against a surface of a brush along a periphery of the brush core in response to rotation of the brush core

Methodology Applied

Scientific EffectFriction: Friction

Implementation Method 4

a rotating unit configured to rotate a brush core extending in a first direction

Methodology Applied

Scientific EffectRotational motion:

Data Source

PatentUS20250351950A1Brush cleaning equipment

Publication Date: 2025.11.20 SAMSUNG ELECTRONICS CO LTD

AI summary

Brush cleaning equipment may include a rotating unit configured to rotate a brush core extending in a first direction, a plate on one side of the brush core and configured to rub against a surface of a brush along a periphery of the brush core in response to the rotation of the brush core, and a cleaning material supply unit on the other side of the brush core opposite to the plate in a second direction intersecting the first direction, and the cleaning material supply unit configured to supply a cleaning material onto a surface of the brush, wherein the cleaning material supply unit includes a main body including a cavity configured to carry the cleaning material, and a nozzle combined with the main body, the nozzle configured to receive the cleaning material from the main body and spray the cleaning material onto the surface of the brush.