Stimulus-Responsive CMP Cleaning Brush for Reverse Contamination
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Contamination from accumulated polished particles on cleaning brushes used in semiconductor manufacturing adversely affects semiconductor substrates, leading to reduced cleaning efficiency and shortened brush lifespan.
Innovation Solution
A cleaning brush with stimulus-responsive ligands that form reversible chemical bonds with metal ions, allowing for the controlled adsorption and desorption of particles using external energy, combined with a cleaning module and method to manage particle removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a cleaning brush is used repeatedly to remove polished particles from semiconductor substrates, then cleaning function is maintained, but polished particles accumulate on the brush causing reverse contamination and shortened lifespan
Solution Approach 1:
The patent applies parameter changes by utilizing the stimulus-responsive ligand's ability to change its chemical structure in response to external stimuli (pH, temperature, light). This allows the binding force between the ligand and metal ions to be dynamically adjusted, enabling the brush to adsorb particles during cleaning and then desorb them for removal, thus preventing accumulation and reverse contamination while maintaining cleaning reliability
Solution Approach 2:
The patent implements periodic action through the cyclic adsorption-desorption process of the stimulus-responsive ligand. The brush periodically switches between adsorbing polished particles (during cleaning operation) and desorbing them (when exposed to external stimulus for regeneration). This periodic behavior prevents continuous accumulation of particles on the brush, eliminating reverse contamination while preserving the cleaning function across multiple cycles
2Productivity
If a cleaning brush is used repeatedly, then cleaning operations can be performed continuously, but the brush lifespan is shortened due to particle accumulation
Solution Approach 1:
The stimulus-responsive ligand changes its binding parameters (binding force) in response to external stimuli, allowing the brush to be regenerated in situ. This parameter change enables the brush to maintain its cleaning capability over extended periods by periodically removing accumulated particles, thus extending brush lifespan while preserving continuous cleaning productivity
Solution Approach 2:
The cleaning brush performs self-service through the autonomous adsorption-desorption cycle of its stimulus-responsive ligand. When exposed to external stimulus (pH change, temperature change, or light), the brush automatically desorbs accumulated particles without requiring manual intervention or replacement. This self-regenerating capability extends the brush lifespan and maintains continuous cleaning operations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances cleaning efficiency by reducing reverse contamination and extending the brush's lifespan, thereby improving semiconductor manufacturing yield.
Implementation Method 1
The stimulus-responsive ligand may form a coordination bond with a metal ion
Implementation Method 2
The functional group may include a spiropyranyl group, a spirooxaginyl group, an oxazyl group, an azobenzyl group, a boron-dipyromethenyl group
Implementation Method 3
The external energy may include light, heat, electrical energy, or a combination thereof
Implementation Method 4
The polymer may include a porous polymer, and the stimulus-responsive ligand may be on the side chain of the porous polymer
Data Source
AI summary
The present disclosure relates to a cleaning brush for a semiconductor device, a cleaning module for a semiconductor device, a chemical mechanical polishing (CMP) equipment, and a post-CMP cleaning method. An example cleaning brush for a semiconductor device includes a polymer with a stimulus-responsive ligand. An example cleaning module for a semiconductor device includes the cleaning brush. An example chemical mechanical polishing equipment includes the cleaning module. An example post-CMP cleaning method uses the cleaning brush, the cleaning module, or the chemical mechanical polishing equipment.