CMP Conditioner with Patterned Diamond Film for Fragment Removal
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional CMP abrasive pad conditioners using CVD diamond film struggle to effectively remove fragments and impurities, leading to a shortened service life due to inadequate removal capabilities.
Innovation Solution
A CMP abrasive pad conditioner with a top surface featuring a patterned configuration and specific center line average roughness (Ra) between 2 and 20, utilizing a bottom substrate, intermediate layer with bumps, and a diamond film forming abrasive projections, enhancing uniformity and removal efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a CVD diamond film is used as polishing material on a conventional conditioner, then the conditioner can perform chemical-mechanical polishing, but it fails to effectively remove fragments and impurities from pores, leading to shortened service life
Solution Approach 1:
The conditioner head is designed with different surface characteristics in different regions: the top surface has a patterned configuration with specific roughness (Ra 2-20) for effective fragment removal, while the bottom surface maintains a smooth finish for proper polishing pad contact. This local differentiation allows the same component to perform both polishing and conditioning functions effectively.
Solution Approach 2:
The intermediate layer incorporates bumps with curved surfaces that conform to the polishing pad surface, enabling better contact and more effective fragment removal. The curved geometry of the bumps allows them to adapt to the spherical or cylindrical shape of the polishing head, improving overall conditioning performance.
2Stability of the object's composition
If the top surface is made smooth for uniform contact, then contact uniformity is improved, but fragment removal capability deteriorates
Solution Approach 1:
The conditioner head is designed with different surface characteristics in different regions: the top surface has a patterned configuration with specific roughness (Ra 2-20) for effective fragment removal, while the bottom surface maintains a smooth finish for proper polishing pad contact. This local differentiation allows the same component to perform both polishing and conditioning functions effectively.
Solution Approach 2:
The conditioner head is divided into functionally distinct surfaces: a top surface with patterned configuration for fragment removal and a bottom surface for uniform contact. This segmentation allows each surface to be optimized for its specific function without compromising the other.
3Object-generated harmful factors
If the top surface is made rough for better fragment removal, then removing capability is improved, but contact uniformity deteriorates
Solution Approach 1:
The conditioner head is designed with different surface characteristics in different regions: the top surface has a patterned configuration with specific roughness (Ra 2-20) for effective fragment removal, while the bottom surface maintains a smooth finish for proper polishing pad contact. This local differentiation allows the same component to perform both polishing and conditioning functions effectively.
Solution Approach 2:
The conditioner head is divided into functionally distinct surfaces: a top surface with patterned configuration for fragment removal and a bottom surface for uniform contact. This segmentation allows each surface to be optimized for its specific function without compromising the other.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The enhanced uniformity and patterned configuration improve the removal of fragments from pores, extending the service life of the CMP conditioner by increasing its removing capability.
Implementation Method 1
a diamond film, formed by chemical vapor deposition, is located on the intermediate substrate
Data Source
AI summary
The present invention provides a CMP abrasive pad conditioner, comprising a bottom substrate; an intermediate layer located on the bottom substrate, the intermediate layer including a hollow portion and an annular portion surrounding the hollow portion, the annular portion being provided with a plurality of bumps; and a diamond film located on the intermediate layer, and forming a plurality of abrasive projections corresponding to the bumps of the intermediate layer; in this case, a top surface of the abrasive projections is formed with a patterned configuration and the top surface is provided with a center line average roughness (Ra) between 2 and 20.