CMP Conditioner Pre-Deformed Substrate Flatness
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Solution Overview
Problem
Chemical mechanical polishing conditioners face deformation during curing due to thermal expansion coefficient differences between the binding layer and substrate, leading to surface flatness issues and reduced polishing efficiency and service life.
Innovation Solution
A chemical mechanical polishing conditioner with a planar substrate and a binding layer that embeds abrasive particles, where the substrate is deformed to become planar during curing, ensuring the abrasive particles have a leveled height and maintaining surface flatness, using materials like type 316 stainless steel and a brazing layer with a matching thermal expansion coefficient.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the binding layer and substrate are cured using conventional methods, then the abrasive particles can be fixed to the substrate, but the substrate deforms due to thermal expansion coefficient differences, destroying surface flatness
Solution Approach 1:
The patent applies preliminary anti-action by pre-deforming the substrate in the opposite direction of the expected thermal expansion deformation before curing. The substrate is intentionally shaped with a pre-deformation amount that compensates for the thermal expansion that will occur during curing, so that when thermal expansion happens, the substrate returns to a flat state rather than deforming
2Ease of manufacture
If the abrasive particles are embedded using a rigid plate pressing method, then the particles can be fixed, but the substrate still deforms during heat-curing due to thermal expansion differences
Solution Approach 1:
The patent applies preliminary action by performing the substrate pre-deformation step before the heat-curing process. The substrate is pre-shaped to account for future thermal expansion, and the abrasive particles are embedded while the substrate is in this pre-deformed state. This sequence ensures that when curing occurs and thermal expansion happens, the substrate naturally returns to flatness, maintaining abrasive particle alignment
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents substrate deformation during curing, maintaining surface flatness and enhancing polishing efficiency and service life by ensuring the abrasive particles remain uniformly levelled.
Implementation Method 1
the difference in thermal expansion coefficient between the binding layer and the substrate may result in deformation of the substrate of the chemical mechanical polishing conditioner after curing
Data Source
AI summary
The present invention relates to a method for manufacturing a chemical mechanical polishing conditioner, comprising: (A) providing a non-planar substrate; (B) providing a binding layer disposed on the surface of the non-planar substrate; (C) providing a plurality of abrasive particles embedded in a surface of the binding layer, and (D) heat curing the binding layer, such that the non-planar substrate is deformed into a planar substrate during curing the binding layer, and the abrasive particles are fixed to a surface of the planar substrate by the binding layer; wherein, after step (D), tips of the abrasive particles have a leveled height. Therefore, the present can effectively improve the problem of thermal deformation of the substrate of the chemical mechanical polishing conditioner during a heat curing process, and enhance surface flatness of the chemical mechanical polishing conditioner.