CMP Conditioner Substrate Deformation Compensation
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Solution Overview
Problem
Chemical mechanical polishing conditioners face surface deformation issues during the curing process due to thermal expansion coefficient differences between the abrasive layer and the substrate, leading to reduced polishing efficiency and service life.
Innovation Solution
A chemical mechanical polishing conditioner with a planar substrate and a binding layer, where abrasive particles are embedded with a leveled tip height, and the substrate contour is designed for deformation compensation to maintain surface flatness, using materials like stainless steel and a brazing layer with controlled thermal expansion coefficients.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the abrasive layer is cured using brazing or sintering methods to fix abrasive particles to the substrate, then the abrasive particles are securely attached, but the substrate surface deforms due to thermal expansion coefficient differences between the abrasive layer and substrate
Solution Approach 1:
The patent applies parameter changes by carefully selecting and controlling the thermal expansion coefficients of the substrate and binding layer materials. The binding layer's thermal expansion coefficient is specifically chosen to match or closely approximate that of the substrate, thereby minimizing thermal stress and deformation during the curing process while still enabling secure attachment of abrasive particles.
Solution Approach 2:
The binding layer serves as an intermediary between the substrate and abrasive particles. This intermediate layer not only secures the abrasive particles but also acts as a thermal expansion buffer, mediating the thermal stress between the substrate and the abrasive layer during curing to prevent substrate deformation.
2Manufacturing precision
If a rigid plate is used to press down abrasive particles to embed and fix them into the abrasive layer, then the surface flatness is maintained, but the manufacturing complexity and labor intensity increase
Solution Approach 1:
The patent replaces the mechanical pressing method (using rigid plates) with a chemical-curing based fixation method. The binding layer is cured to chemically and mechanically bond the abrasive particles to the substrate, eliminating the need for complex mechanical pressing equipment and manual labor while achieving both secure attachment and surface flatness.
Solution Approach 2:
The curing process transforms the binding layer from a soft, pliable state (allowing easy particle embedding) to a rigid, strong state (providing secure fixation and maintaining surface flatness). This parameter change in the binding layer's mechanical properties enables automated manufacturing while ensuring both attachment strength and surface quality.
3Manufacturing precision
If the substrate is made non-planar with a curved surface contour to compensate for deformation during curing, then surface flatness can be achieved, but the design precision and manufacturing cost increase
Solution Approach 1:
Instead of changing the geometric shape of the substrate, the patent changes the material parameter (thermal expansion coefficient) of the binding layer to match the substrate. This material parameter adjustment eliminates the need for complex non-planar substrate designs, achieving surface flatness through material selection rather than geometric compensation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents substrate deformation during curing, maintaining surface flatness and enhancing polishing quality and efficiency by varying the substrate's height and contour to compensate for thermal expansion differences.
Implementation Method 1
the difference in thermal expansion coefficient between the abrasive layer and the substrate, thus destroying flatness of the abrasive particles of the conditioner
Implementation Method 2
fix the abrasive layer to the surface of the substrate by brazing or sintering methods
Implementation Method 3
fix the abrasive layer to the surface of the substrate by brazing or sintering methods
Data Source
AI summary
The present invention relates to a chemical mechanical polishing conditioner and manufacturing methods thereof. The chemical mechanical polishing conditioner comprises: a planar substrate having a leveling surface; a bonding layer disposed on the surface of the planar substrate; and a plurality of abrasive particles embedded in the surface of the bonding layer and fixed to the surface of the planar substrate by the binding layer; wherein the planar substrate is formed by a deformation compensation for the non-planar substrate during curing the binding layer, and thus the tips of the abrasive particles have a leveled height. Therefore, the present invention can effectively improve the problem of thermal deformation of the substrate of the chemical mechanical polishing conditioner during heating and curing process, and thereby enhancing the surface flatness of chemical mechanical polishing conditioner.