CMP Apparatus with Rotating Deposit Table for Planarization

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Solution Overview

Problem

In semiconductor device manufacturing, chemical mechanical polishing (CMP) often struggles with planarization due to the pattern of wiring, leading to difficulties in achieving a flat surface, especially with stepped or concave portions.

Innovation Solution

A polishing apparatus with a depositing table that rotates and supplies slurry containing particles, which are fixed onto the polishing target surface, allowing for effective protection and polishing of these areas, combined with a temperature control system to enhance particle fixation and evaporation of solvents, ensuring uniform polishing across irregular surfaces.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If chemical mechanical polishing (CMP) is used for planarization, then polishing can be performed on semiconductor surfaces, but planarization is difficult due to wiring patterns creating stepped or concave portions

Engineering Contradiction:

Improvesurface planarityVSAvoidpolishing difficulty

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent applies preliminary action by fixing particles onto the stepped or concave portions of the semiconductor surface before the actual polishing process. This preparatory step ensures that difficult-to-polish areas are pre-treated with particles that will remain in place during polishing, enabling better planarization of the overall surface.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent applies local quality by selectively placing particles only on specific stepped or concave portions of the surface rather than uniformly across the entire surface. This localized particle fixation addresses the specific polishing difficulties at irregular areas while allowing normal polishing in flat regions, thereby improving overall surface planarity.

Inventive Principle:

Principle #3Local quality

2Reliability

If particles are supplied onto stepped portions to protect them during polishing, then particle fixation is achieved, but particles may be removed during subsequent processing

Engineering Contradiction:

Improveparticle fixation stabilityVSAvoidparticle removal

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent converts the potential harm of particle removal into a benefit by using the particle fixation process itself to achieve the desired outcome. The particles are fixed onto stepped portions to protect them during polishing, and even if some particles are removed during subsequent processing, the polishing protection function has already been fulfilled, transforming the temporary particle presence into a beneficial polishing result.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The patent applies preliminary action by fixing particles onto the surface before polishing occurs. This preliminary particle fixation ensures that protected areas are prepared in advance, and the particles serve their protective function during the subsequent polishing process, regardless of whether they remain fully intact afterward.

Inventive Principle:

Principle #10Preliminary action

3Productivity

If slurry is supplied continuously during polishing, then polishing can proceed, but solvents do not evaporate efficiently affecting particle fixation

Engineering Contradiction:

Improvepolishing speedVSAvoidsolvent evaporation

Core Design Contradiction:

ProductivityVSTemperature

Solution Approach 1:

The patent applies periodic action by alternating between slurry supply and drying phases during the polishing process. During slurry supply, polishing proceeds with particle protection; during drying phases, heat is applied to evaporate solvents and enhance particle fixation. This periodic alternation maintains both polishing productivity and effective particle fixation through controlled solvent evaporation.

Inventive Principle:

Principle #19Periodic action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables flatter polishing of semiconductor surfaces by protecting and fixing particles onto stepped or concave portions, preventing their removal during processing, thus improving surface planarity and manufacturing efficiency.

Implementation Method 1

particles are fixed onto at least part of the polishing target surface

Methodology Applied

Scientific EffectAdhesion: Adhesive

Implementation Method 2

evaporation of solvents

Methodology Applied

Scientific EffectEvaporation: Evaporation

Implementation Method 3

temperature control system to enhance particle fixation and evaporation of solvents

Methodology Applied

Scientific EffectHeating: Heating

Data Source

PatentUS20240308027A1Polishing apparatus, polishing method, and semiconductor device manufacturing method

Publication Date: 2024.09.19 KIOXIA CORP

AI summary

A polishing apparatus according to the present embodiment includes a head, a polishing table, a rotation table, a particle supplier, and one chamber. The head holds an object. The polishing table polishes a polishing target surface of the polishing target object. The rotation table is capable of contacting the polishing target surface. The particle supplier supplies slurry containing particles onto the rotation table so that the particles are fixed onto at least part of the polishing target surface, while the polishing target surface is contacting the rotation table. The one chamber houses the polishing table and the rotation table.