CMP Conditioning Disk Surface Chemistry for Wear Reduction

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Solution Overview

Problem

The maintenance and management costs of chemical mechanical polishing apparatuses have increased due to rapid wear of the pad conditioning disk, necessitating a solution to extend the replacement cycle of the pad conditioning disk.

Innovation Solution

The polarity of the zeta potential on the surfaces of diamond particles on the conditioning disk is made identical to that of the slurry liquid, using hydrogen or oxygen termination to create a repulsive force and reduce abrasion between the diamond particles and polishing particles, thereby preventing excessive wear.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the pad conditioning disk is used to condition the polishing pad, then the polishing pad surface roughness is maintained, but the conditioning disk wears rapidly requiring frequent replacement

Engineering Contradiction:
Improvepolishing pad surface roughness maintenanceVSAvoidconditioning disk replacement cycle
Core Design Contradiction:
ReliabilityVSDuration of action of moving object

Solution Approach 1:

The patent applies parameter changes by modifying the zeta potential polarity of diamond particles on the conditioning disk surface through hydrogen termination. This changes the electrostatic interaction parameters between conditioning particles and slurry particles, transforming the attractive force into a repulsive force, thereby reducing wear and extending the conditioning disk replacement cycle while maintaining polishing pad surface roughness

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent uses composite materials by combining diamond particles with specific surface termination (hydrogen-terminated) to create a conditioning disk surface with unique electrostatic properties. This composite structure maintains the hardness and conditioning capability of diamond while adding electrostatic repulsion through surface termination, solving the wear problem without sacrificing conditioning effectiveness

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach significantly reduces the wear of the conditioning disk, leading to a longer replacement cycle and decreased maintenance costs by minimizing physical collisions and maintaining optimal surface roughness of the polishing pad.

Implementation Method 1

the plurality of diamond particles are terminated with specific elements on surfaces thereof, and a polarity of a zeta potential on the surfaces of the plurality of diamond particles is the same as a zeta potential on the polishing particles of the slurry liquid

Methodology Applied
Scientific EffectZeta potential: Electrostatics

Data Source

PatentUS20240278383A1Chemical mechanical polishing apparatus and chemical mechanical polishing method
Publication Date: 2024.08.22 SAMSUNG ELECTRONICS CO LTD
  • US20240278383A1 patent drawing
  • US20240278383A1 patent drawing
  • US20240278383A1 patent drawing

AI summary

The inventive concept provides a chemical mechanical polishing apparatus including a polishing pad providing a flat main surface to which a slurry liquid having polishing particles is supplied and a conditioning disk on the main surface of the polishing pad. The conditioning disk can include a plurality of diamond particles that are positioned on a surface of the conditioning disk facing the main surface of the polishing pad, and wherein the plurality of diamond particles are terminated with specific elements on surfaces thereof, and a polarity of a zeta potential on the surface of the diamond particles is the same as that of a zeta potential on the polishing particles of the slurry liquid.