CMP Substrate Edge Cleaning Rotary Arm Module
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Solution Overview
Problem
Conventional cleaning modules struggle to effectively remove abrasive particles, particularly cerium oxide, from the edges of substrates after chemical mechanical planarizing (CMP), requiring additional buffing processes and occupying critical space in CMP systems.
Innovation Solution
A particle cleaning module with a rotary arm assembly and dual pad holders allows for slurry polishing at the substrate's edge without affecting the device area, using a soft pad and controlled motion to remove particles and perform polishing, thereby reducing the need for a dedicated buffing station.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional cleaning module is used to remove abrasive particles from substrate edges, then cleaning capability is improved, but device complexity and space requirements increase due to the need for a separate buffing station
Solution Approach 1:
The patent combines the cleaning function and buffing function into a single integrated module. The cleaning module includes a cleaning pad for removing particles and a buffing pad for removing abrasives, both operable on the same substrate holder without requiring a separate buffing station. This merging eliminates the need for additional equipment while maintaining both cleaning and buffing capabilities.
Solution Approach 2:
The cleaning module is designed to perform multiple functions: it can clean substrate surfaces with a cleaning pad, buff substrate edges with a buffing pad, and condition pads in place. This multi-functional design allows a single module to replace what would traditionally require separate cleaning and buffing stations, reducing device complexity while improving versatility.
2Manufacturing precision
If a separate buffing station is added to remove cerium oxide abrasives, then manufacturing precision is improved, but productivity decreases due to additional processing steps and space occupation
Solution Approach 1:
The cleaning and buffing operations are merged into a single module that can process substrates sequentially without transfer between separate stations. The substrate remains on the same holder, allowing continuous processing through cleaning, rinsing, and buffing operations in one integrated flow, thereby maintaining productivity while achieving precise abrasive removal.
Solution Approach 2:
The cleaning pad performs preliminary particle removal from the substrate surface before the buffing pad addresses abrasive removal at the edges. This preliminary cleaning action prepares the substrate for more effective buffing, improving the overall efficiency of abrasive removal without requiring additional processing steps.
3Device complexity
If conventional cleaning processes are used, then device simplicity is maintained, but manufacturing precision deteriorates due to inability to effectively remove abrasive particles from oxide surfaces
Solution Approach 1:
The module uses segmented pads with different functions: a cleaning pad for particle removal, a buffing pad for abrasive removal, and a conditioning pad for pad maintenance. Each segment is optimized for its specific function, allowing the module to achieve high manufacturing precision through specialized components while remaining integrated in a single device.
Solution Approach 2:
The module changes operational parameters between cleaning and buffing modes, including pad selection, fluid delivery parameters, and rotational speeds. These parameter changes allow the same hardware platform to perform different functions effectively, maintaining device simplicity while achieving superior particle and abrasive removal through optimized process parameters.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances CMP system throughput, reduces consumable costs, and effectively cleans substrate edges, improving defect reduction while eliminating the need for a separate buffing station, thus optimizing space and efficiency.
Implementation Method 1
a rotary arm assembly... operable for sweeping the second pad holder across the surface of the substrate
Implementation Method 2
providing a cleaning fluid to a surface of the spinning substrate
Implementation Method 3
the substrate holder configured to retain a substrate in a substantially vertical orientation, the substrate holder rotatable on a first axis
Implementation Method 4
the first pad holder rotatable on a second axis rotatable parallel to the first axis... the second pad holder rotatable on a third axis parallel to the first axis and the second axis
Data Source
AI summary
A method and apparatus for cleaning a substrate after chemical mechanical planarizing (CMP) is provided. The apparatus comprises a housing, a substrate holder rotatable on a first axis and configured to retain a substrate in a substantially vertical orientation, a first pad holder having a pad retaining surface facing the substrate holder in a parallel and space apart relation, the first pad holder rotatable on a second axis rotatable parallel to the first axis, a first actuator operable to move the pad holder relative to the substrate holder to change a distance defined between the first axis and the second axis, and a second pad holder disposed in the housing, the second pad holder having a pad retaining surface facing the substrate holder in a parallel and spaced apart relation, wherein the second pad holder is couple with a rotary arm.