CMP Polishing Layer Density Defect Reduction via 3D Nozzle Motion
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Solution Overview
Problem
Conventional methods for manufacturing polishing layers for chemical mechanical polishing pads often result in density defects, leading to unpredictable and potentially detrimental variations in polishing performance.
Innovation Solution
A method involving a mold with a doughnut hole and doughnut region, where the nozzle opening moves in three dimensions along the mold cavity's central axis during the charging period, ensuring a more uniform distribution of the curable mixture and reducing density defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the nozzle opening is maintained centrally and moves only in one dimension during charging, then the process is simple and easy to control, but density defects occur in the polishing layers
Solution Approach 1:
The patent applies dimensional change by transitioning the nozzle movement from one dimension (vertical only) to three dimensions (vertical, radial, and tangential). The nozzle is positioned to move vertically along the central axis, radially across the mold cavity cross-section, and tangentially around the central axis, creating comprehensive coverage that eliminates density defects while maintaining process control.
Solution Approach 2:
The patent implements dynamic nozzle positioning where the nozzle opening location changes continuously during the charging period. The nozzle moves dynamically through multiple phases: initially positioned centrally, then transitioning to off-center positions, and finally moving tangentially, adapting its position to optimize material distribution throughout the mold cavity.
2Reliability
If the nozzle opening location is stationary relative to the top surface of curable material, then the charging process is straightforward, but density defects and polishing performance variations occur
Solution Approach 1:
The patent enhances reliability by adding radial and tangential movement dimensions to the nozzle positioning system. This three-dimensional movement pattern ensures uniform distribution of curable mixture and filler materials throughout the mold cavity, eliminating the density defects that cause polishing performance variations, while the controlled motion maintains operational feasibility.
Solution Approach 2:
The patent employs preliminary action by pre-planning and executing a specific multi-phase nozzle movement trajectory before charging begins. The nozzle follows a predetermined path that includes initial central positioning, radial transitions, and tangential movements, ensuring optimal material distribution is achieved proactively rather than reactively.
Data Source
AI summary
A method of manufacturing polishing layers for use in chemical mechanical polishing pads is provided, wherein the formation of density defects in the polishing layers is minimized.