CMP Polishing Magnetic Field Particle Control
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Solution Overview
Problem
Current chemical mechanical polishing (CMP) processes face challenges in controlling the radial distribution of abrasive particles, leading to non-uniform surface profiles and retention of particles on substrates, which can result in defects during subsequent manufacturing steps.
Innovation Solution
A CMP processing system with an applied magnetic field is used to control the distribution and removal of charged particles by generating a magnetic field that induces movement of particles parallel to the polishing surface, combined with an electric field to detach particles from the substrate, ensuring uniformity and cleanliness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional CMP processes are used, then polishing can be performed, but radial distribution of abrasive particles cannot be controlled uniformly
Solution Approach 1:
The patent applies magnetic field strength as a controllable parameter to influence abrasive particle distribution. By adjusting the magnetic field parameters (strength, direction, spatial distribution), the system achieves uniform radial distribution of charged abrasive particles across the polishing surface, directly addressing the surface profile uniformity issue without requiring complex mechanical modifications to the polishing apparatus.
Solution Approach 2:
The patent replaces conventional mechanical methods of particle distribution control with a magnetic field-based system. Instead of relying on mechanical agitation, slurry flow dynamics, or physical manipulation of the polishing pad, the invention uses magnetic fields to exert forces on charged abrasive particles, achieving uniform distribution through electromagnetic interaction rather than mechanical means.
2Productivity
If conventional polishing processes are used, then material removal occurs, but abrasive particles are retained on substrate surface
Solution Approach 1:
The patent uses magnetic field forces to replace mechanical cleaning methods for particle removal. After polishing, the magnetic field is adjusted to exert forces on residual charged abrasive particles on the substrate surface, causing them to detach and be removed from the substrate. This electromagnetic approach to particle removal is more effective than conventional mechanical wiping or rinsing methods.
Solution Approach 2:
The system employs periodic or cyclic application of magnetic field configurations. During polishing, one magnetic field configuration maintains uniform particle distribution. After polishing, the magnetic field parameters are changed (reversed or adjusted) to create forces that detach and remove residual particles from the substrate surface, enabling both polishing and cleaning functions through periodic parameter changes.
3Manufacturing precision
If magnetic field is applied to control particle distribution, then surface uniformity improves, but energy consumption increases
Solution Approach 1:
The patent implements local magnetic field application rather than uniform field generation across the entire polishing system. Magnetic field sources are positioned strategically at specific locations where particle distribution control is needed, and field strength is adjusted locally to match the specific requirements of different radial zones on the polishing surface. This localized approach reduces overall energy consumption compared to generating a strong uniform field across the entire system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively tunes the surface profile and removes abrasive particles, enhancing surface uniformity and reducing defects, thereby improving the quality of electronic device manufacturing.
Implementation Method 1
The magnetic fields generated by the array of electromagnetic devices are oriented and configured to induce an electromagnetic force on a plurality of charged particles disposed in a polishing slurry disposed on the polishing surface
Implementation Method 2
an electric field to detach particles from the substrate
Data Source
AI summary
A polishing station for polishing a substrate using a polishing slurry is disclosed. The polishing station includes a substrate carrier having a substrate-receiving surface and a rotatable platen having a polishing pad disposed on a platen surface, where the polishing pad has a polishing surface facing the substrate-receiving surface. The polishing station includes an electromagnetic assembly disposed over the platen surface. The electromagnetic assembly includes an array of electromagnetic devices that are each operable to generate a magnetic field that is configured to pass through the polishing surface. The magnetic fields generated by the array of electromagnetic devices are oriented and configured to induce an electromagnetic force on a plurality of charged particles disposed in a polishing slurry disposed on the polishing surface. The applied magnetic field is configured to induce movement of the plurality of charged particles in a direction parallel or orthogonal to the polishing surface.