CMP Polishing Layer Microsphere Density Control

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Solution Overview

Problem

Chemical mechanical polishing (CMP) pads with inconsistent microsphere size distribution and impurities lead to wafer scratching and defects during semiconductor wafer polishing, as existing classification methods are ineffective in removing dense regions and impurities, resulting in gouging and chatter marks.

Innovation Solution

The method involves centrifugal air classification using a Coanda block to separate liquid-filled microspheres into fines, medium, and coarse particles, followed by converting them into gas-filled microspheres to create a homogeneous polishing layer with reduced impurities, using a polymeric pad matrix with specific polymers and porosity to enhance polishing consistency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If expanded microspheres are classified using a centrifugal air classifier based on inertia, then particle size distribution is improved, but dense regions and impurities remain in the microspheres

Engineering Contradiction:
Improvemicrosphere size distributionVSAvoidimpurities and dense regions
Core Design Contradiction:
Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The patent applies preliminary action by classifying liquid-filled microspheres before they are expanded into foam microspheres. The centrifugal air classifier separates liquid-filled microspheres based on their density and size, removing impurities and dense regions (such as unreacted monomers and catalyst residues) before the expansion process. This preliminary classification ensures that only high-quality microspheres undergo expansion, preventing the formation of defects in the final foam structure.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent utilizes parameter changes by exploiting the density difference between liquid-filled microspheres and impurities during centrifugal classification. The classifier operates at controlled air flow rates and rotation speeds to optimize separation based on density parameters. After classification, the microspheres undergo expansion where the liquid filling evaporates or reacts, changing the density parameter again to create the final foam structure with improved uniformity.

Inventive Principle:
Principle #35Parameter changes

2Stability of the object's composition

If inorganic particles are used as stabilizing agents during polymerization, then polymerization stability is improved, but dense regions and impurities are introduced into the microspheres

Engineering Contradiction:
Improvepolymerization stabilityVSAvoidinorganic impurities
Core Design Contradiction:
Stability of the object's compositionVSObject-affected harmful factors

Solution Approach 1:

The patent applies the taking out principle by removing inorganic particles and other impurities from the microsphere composition through centrifugal classification. The classifier extracts and separates these harmful inorganic stabilizing agents from the liquid-filled microspheres based on density differences. This extraction process eliminates the source of dense regions and impurities that would otherwise remain trapped in the microsphere structure after expansion.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent converts the potential harm of using inorganic stabilizing agents into a benefit by utilizing the density difference they create. The inorganic particles, while harmful if retained, provide a useful density contrast that enables effective separation through centrifugal classification. The harmful inorganic impurities are thus converted into a useful separation mechanism, allowing their removal and improving the final product quality.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

3Manufacturing precision

If expanded microspheres are classified after expansion, then classification is performed on final product, but secondary expansion during curing causes inconsistencies

Engineering Contradiction:
Improveproduct classification accuracyVSAvoidmicrosphere expansion consistency
Core Design Contradiction:
Manufacturing precisionVSStability of the object's composition

Solution Approach 1:

The patent applies preliminary action by performing classification on liquid-filled microspheres before the expansion and curing processes. This timing ensures that the microspheres are classified in their stable liquid-filled state, before any secondary expansion can occur during curing. The classification is completed while the microsphere composition is still uniform and controllable, preventing later inconsistencies.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent segments the manufacturing process into distinct stages: (1) synthesis of liquid-filled microspheres, (2) centrifugal classification of liquid-filled microspheres, (3) expansion to foam microspheres, and (4) curing. By segmenting the process and performing classification at the liquid-filled stage, the patent avoids the problem of secondary expansion during curing affecting classification accuracy. Each stage is optimized independently, with classification occurring when microspheres are most stable and controllable.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach results in a more uniform and consistent polishing layer, reducing wafer defects and improving yield by effectively removing impurities and preventing secondary expansion during polymer curing, leading to smoother and more precise semiconductor wafer surfaces.

Implementation Method 1

classifying the composition via centrifugal air classification to remove fines and coarse particles and produce liquid-filled microspheres having a density of 800 to 1500 g/liter

Methodology Applied
Scientific EffectCentrifugal separation: Centrifugal Separation

Implementation Method 2

converting the classified liquid-filled microelements into gas-filled microelements having a density of from 10 to 100 g/liter by heating them to from 70 to 270° C.

Methodology Applied
Scientific EffectThermal heating: Heating

Implementation Method 3

allowing the reaction exotherm to convert the liquid-filled microelements to gas-filled microelements

Methodology Applied
Scientific EffectExothermic reaction: Exothermic Reaction

Data Source

PatentUS11524390B2Methods of making chemical mechanical polishing layers having improved uniformity
Publication Date: 2022.12.13 DDP SPECIALTY ELECTRONICS MATERIALS US LLC
  • US11524390B2 patent drawing
  • US11524390B2 patent drawing

AI summary

The present invention provides methods of manufacturing a chemical mechanical polishing (CMP polishing) layer for polishing substrates, such as semiconductor wafers comprising providing a composition of a plurality of liquid-filled microelements having a polymeric shell; classifying the composition via centrifugal air classification to remove fines and coarse particles and to produce liquid-filled microelements having a density of 800 to 1500 g/liter; and, forming the CMP polishing layer by (i) converting the classified liquid-filled microelements into gas-filled microelements by heating them, then mixing them with a liquid polymer matrix forming material and casting or molding the resulting mixture to form a polymeric pad matrix, or (ii) combining the classified liquid-filled microelements directly with the liquid polymer matrix forming material, and casting or molding.