CMP Nozzle Tip Retreating Mechanism for Slurry Scattering Control
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Solution Overview
Problem
Existing substrate processing apparatuses face issues with slurry scattering during the polishing process, leading to contamination and interference with peripheral devices, as the slurry dropping height from the nozzle is high due to the need to avoid other processing devices on the table, causing scratches and requiring additional cleaning steps that can dilute the slurry and affect the CMP process.
Innovation Solution
A substrate processing apparatus with a nozzle tip retreating mechanism that brings the nozzle tip into a retreated state above the processing devices when moving between the fluid dropping position and the retreat position, ensuring the slurry is dropped at a lower height and minimizing scattering, while avoiding interference with atomizers and dressers on the polishing table.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the nozzle is positioned high to avoid interference with processing devices, then the nozzle can move freely between positions, but the slurry scattering increases and contaminates peripheral devices
Solution Approach 1:
The patent introduces a vertical dimension to the nozzle tip movement by incorporating a nozzle tip retreating mechanism that moves the tip upward along the nozzle axis. This allows the nozzle body to remain in its original position for easy movement while the tip retracts vertically to avoid scattering slurry onto peripheral devices during the retreat motion
2Object-affected harmful factors
If the nozzle is positioned low to reduce slurry scattering, then the slurry dropping height is reduced, but the nozzle interferes with processing devices such as atomizers and dressers
Solution Approach 1:
The patent divides the nozzle into two independent functional parts: the nozzle body that remains stationary and maintains proper positioning relative to processing devices, and the nozzle tip that can independently retreat vertically. This segmentation allows the body to stay low for device compatibility while the tip can retract to minimize slurry scattering
3Productivity
If the nozzle moves quickly between positions, then the processing efficiency increases, but the slurry scattering becomes more severe
Solution Approach 1:
The patent implements a preliminary action by having the nozzle tip retreat vertically along the axis before the nozzle body moves to its new position. This preliminary retraction prevents slurry from scattering onto peripheral devices during the subsequent rapid movement, allowing high-speed operation without increasing contamination
Data Source
AI summary
Disclosed is a substrate processing apparatus that includes: a polishing table; an atomizer configured to spray a fluid to a polishing surface; a polishing liquid supply nozzle configured to drop a slurry at a position that corresponds to a slurry dropping position set on the polishing table and is lower than the top surface of the atomizer; a nozzle moving mechanism configured to move the polishing liquid supply nozzle above the atomizer between the retreat position set outside the polishing table and the slurry dropping position; and a nozzle tip retreating mechanism configured to bring the tip end of the polishing liquid supply nozzle into a retreated position above the top surface of the atomizer when the polishing liquid supply nozzle moves between the slurry dropping position and the retreat position.