Reactive Hot Melt Adhesive Bonding for CMP Pad Delamination
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Solution Overview
Problem
Conventional multilayer chemical mechanical polishing pads laminated with pressure sensitive adhesives tend to delaminate during use, leading to internal breakdown and rendering the polishing pads useless.
Innovation Solution
A method for manufacturing multilayer chemical mechanical polishing pads using an unset reactive hot melt adhesive applied in a pattern of parallel lines between the polishing layer and subpad layer, with a force applied to set the adhesive, forming a robust bond between the layers, and optionally using wrap-around tabs and sacrificial layers for secure attachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If pressure sensitive adhesive is used to laminate polishing layer and subpad layer, then the manufacturing process is simple, but the bonding strength is insufficient leading to delamination during polishing
Solution Approach 1:
The patent changes the adhesive from pressure-sensitive type to reactive hot melt type, which undergoes chemical parameter changes (crosslinking reaction) upon curing. This transformation elevates the bonding mechanism from physical adhesion to chemical bonding, achieving T-peel strength ≥111 N while maintaining manufacturing simplicity through the hot melt application process
Solution Approach 2:
The patent creates a composite adhesive system combining hot melt properties (ease of application) with reactive crosslinking chemistry (superior bond strength). The adhesive comprises epoxy resin, polybasic acid anhydride, and inert filler, forming a composite material that achieves both manufacturing ease and reliability
2Reliability
If reactive hot melt adhesive is used to bond polishing layer and subpad layer, then delamination resistance is improved, but the manufacturing process complexity increases
Solution Approach 1:
The patent applies the reactive hot melt adhesive in an unset (molten) state before bonding, allowing easy spreading and positioning. The adhesive then cures after lamination, performing the bonding action after the structural arrangement is complete. This preliminary application in a manageable state reduces process complexity
Solution Approach 2:
The patent replaces complex mechanical bonding systems (multiple clamps, gradual compression) with a chemical bonding system. The reactive adhesive self-bonds through crosslinking upon curing, eliminating the need for complex mechanical fastening systems and reducing overall manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method creates a robust reactive hot melt adhesive bond with a T-peel strength of at least 111 N, preventing delamination and ensuring the pads' integrity during polishing operations.
Implementation Method 1
allowing the unset reactive hot melt adhesive to set forming a reactive hot melt adhesive bond between the polishing layer and the subpad layer
Implementation Method 2
applying the unset reactive hot melt adhesive to the subpad layer, wherein the unset reactive hot melt adhesive is applied in a pattern of parallel lines
Implementation Method 3
applying a force to the polishing pad stack pressing the polishing layer and subpad layer together
Data Source
AI summary
A method for making a multilayer chemical mechanical polishing pad comprising: providing a polishing layer, providing a subpad layer, optionally providing additional layers, providing an unset reactive hot melt adhesive, applying the unset reactive hot melt adhesive in a pattern on a surface of at least one of the layers, applying one of the other layers over the pattern of unset reactive hot melt adhesive, pressing the two layers together with the unset reactive hot melt adhesive interposed therebetween, allowing the unset reactive hot melt adhesive to set forming a reactive hot melt adhesive bond between the two layers.